2019/1/16(Wed) to 18(Fri), We appreciate you coming to 20^th IC & Sensor Packaging Technology EXPO.

Exhibit Products

• Plating technology for the latest semiconductor packaging
• ● Ultra-fine Pattern Formation
• ● Additives for Acid Copper Plating to Fill Laser Through-hole "TOP LUCINA LTF"
• ● Electroless Copper Plating Process for Higher Connecting Reliability "OPC FLETPROCESS"
• ● Additives for Acid Copper Plating to Via-filling (For Fine Pattern) "TOP LUCINA FRV"
• ● For Ultra Fine Patterns, Additives for Acid Copper Plating to Via-filling "TOP LUCINA NPF"
• ● Pd Residue Removing Agent Applicable to Spraying Machine "OPC PALADELETE IF"
• ● Electroless Au Plating Process on Cu "TOP GILDPROCESS"
• ● Electroless Pd/Au Plating Process on Cu "TOP PALLAS PROCESS"
• ● Additives for Acid Copper Plating (For Wafer) "TOP LUCINA CP/SV/SD"
• Plating technology for power device
• ● Electroless Ni/Au Plating Process for Al Electrode On Wafer "TOP UBP PROCESS"
• ● Electroless Nickel Plating Solution with Strong Crack Resistance and Great Solder Joint Performance "ICP NICORON LPW-LF"
• ● Electroless Ag Plating Process on Cu Substrates "TOP SILVE ACC"
• Printed electronics - To build IoT community -
• ● Environmentally-Friendly PWB PROCESS "EF-PWB PROCESS"
• ● Cyanide-free, High-speed Electroless Copper Plating Solution "OPC COPPER NCA"
• ● Paste to Form Seed Layer for Electroless Plating "TOP ALP CP-1958"
• Lead-free Glass Powder for Electronic Components