2022.08.30Metal Finishing

SANKEN of Osaka University posted a new research about Improved reliability of printed circuit boards by OKUNO's plating process

SANKEN of Osaka University posted a new research to prevent microvia deterioration for advanced printed circuit boards in IC substrates. In the plating process, OKUNO's new electroless copper plating process (OPC FLET PROCESS) is used.
OPC FLET PROCESS can ensure high covering performance by small thickness in via-holes, and high connection reliability between inner copper layer and plated copper films from copper crystal continuity.
For more details, please click this page, https://www.sanken.osaka-u.ac.jp/en/hot_topics/topics_20220823/.