2023.11.02Metal FinishingInorganic MaterialsExhibitions

We appreciate your coming to TPCA Show 2023

Thank you for dropping by our booth at "TPCA Show 2023" at Taipei of Taiwan" from October 25 to 27.
Please contact to get more information from Send message button.

Date

2023.10.25 (Wed) to 2023.10. 27 (Fri)

Place

Nangang Exhibition Center Hall (TaiNEX 1)

Content

Plating technology for wafer

• Acid copper plating additives
  Additive for acid copper plating for TSV filling
  Additive for acid copper plating for Cu pillar formation
  Additive for acid copper plating for low aspect ratio via and trench filling
• Electroless copper plating process ensuring high adhesion for glass substrates
• UBM (Under Barrier Metallization) process for Al electrode on wafer

The latest surface finish for IC substrates

• Electroless Cu plating process for high connection reliability
• Additive for acid copper plating for high thickness uniformity and via filling
• Palladium residue remover applicable to fine patterns
• Electroless Ni/Au process using reduced cobalt catalyzing solution

The latest surface finish for PWB

• Additive for acid copper plating with high via-filling performance to large diameter holes

The latest surface finish for FPC

• Electroless Cu plating process to LCP films for high-frequency and high-speed transmission
• Additive for acid copper plating applicable to horizontal Roll to Roll plating equipment
• Electroless Ni/Au process for ultra-fine pattern formation

The latest surface finish for power modules

• Electroless plating process to dielectronic substrates for power modules

Glass materials for electronic components