Newsroom

2025.05.13Metal FinishingExhibitions

Okuno will exhibit at SEMISOL 2025.

Okuno will exhibit at SEMISOL 2025.
We are looking forward to meeting you at our booth with the latest plating technology and products.

By visitor registration, admission fee will become free.
For more information, please visit the website below.

semisol_okuno_booth_en

Date

2025.6.18 Wed. to 20 Fri. 10:00 a.m. to 5:00 p.m.

Place

TOKYO BIG SIGHT, East Exhibition Hall 8 【G-2】

Content

Surface finishing technology to glass core substrares

  • Highly adhesive plating process on glass
  • Acid copper plating additive for through-hole filling to glass core substrates

Plating technology for wafer and power modules

  • UBM formation on aluminum electrode on wafer
  • Electroless plating equipment for wafer to make UBM
  • Acid copper plating additive to silicon interposer for high aspect ratio filling
  • Acid copper plating additive to micro bump and trench filling
  • Acid copper plating additive to FO-PLP/WLP, high current density for copper pillar formation
  • Acid copper plating additive for ultra-fine pattern formation
  • Acid copper plating additive for Cu-Cu hybrid bonding
URL
https://www.smartsensingexpo.com/

Back