2025.05.16Metal FinishingExhibitions

We'll Exhibit in Singapore with C&M at SEMICON SEA 2025.

We’re pleased to announce our participation as an exhibitor at SEMICON Southeast Asia 2025, the region's premier event for the semiconductor and electronics manufacturing industries.

During the event, we will be introducing TORYZA LCN series, an additive for acid copper plating designed for high aspect ratio filling and ultra-fine pattern formation, and TOP LUCINA GCS series, the acid-copper plating additives that enable through-hole filling to glass substrates with excellent dimensional stability and void-free results, along with a range of other products.

Visitor registration is now open — apply through the official SEMICON SEA 2025 website to secure your entry and be part of this exciting event. For further details, please visit the official website of SEMICON Southeast Asia 2025.

Date

May 20, Tue. to May 22, Thur. in 2025

Place

Booth No. B1929 in Japan Pavilion, Sands Expo and Convention Centre (Singapore)

Content

• TORYZA LCN series, Acid copper plating additive for semiconductor wafer
• TORYZA LCN LXD, Acid copper plating additive for copper-copper hybrid bonding
• TORYZA LCN GCS series, Acid copper plating additive for through-hole filling to glass substrates
• OPC FLET PROCESS, Electroless copper plating to solve Weak-Micro Via for high connection reliability
• TOP LUCINA NSV ADV, Acid copper plating additive for high-current density, fine pattern via filling
• TOP LUCINA NSV LV, Acid copper plating additive for large diameter vias
• TORYZA EL PROCESS, UBM formation on aluminum electrode on wafer

URL

https://www.semiconsea.org/