2025.06.04Metal FinishingExhibitions

We Exhibited in Singapore with C&M at SEMICON SEA 2025.

From May 20 to May 22, in 2025, we participated in SEMICON Southeast Asia 2025, the region's premier event for the semiconductor and electronics manufacturing industries. During the event, we introduced TORYZA LCN series, an additive for acid copper plating designed for high aspect ratio filling and ultra-fine pattern formation, and TOP LUCINA GCS series, the acid-copper plating additives that enable through-hole filling to glass substrates with excellent dimensional stability and void-free results, along with a range of other products. For more information, please contact us without hesitation.