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2025.08.29Metal FinishingExhibitions

We will exhibit at SEMICON TAIWAN.

OKUNO TAIWAN CO., LTD. will exhibit at SEMICON TAIWAN to be held at TaiNEX 1&2, Taipei, Taiwan from September 10(Wed) to 12(Fri), 2025.
We will introduce the latest surface treatment chemicals and process for semiconductor wafers, and glass core substrates.
Free admission is available on the days of the show, so we look forward to seeing you there.
For more information, please visit the official website of "SEMICON TAIWAN" .semicon_taiwan_booth_en

Date

September 10 (Wed.) to 12 (Fri.) ,2025

Place

Taipei Nangang Exhibition Center(TaiNEX),Taiwan

Content

Surface finishing and plating technology for semiconductor wafers

  • UBM formation on aluminum electrodes on wafers,
    “TORYZA EL PROCESS”
  • Acid copper plating additive to silicon interposer for high-aspect ratio filling
    “TORYZA LCN SV”
  • Acid copper plating additive to micro-bump and trench filling
    “TORYZA LCN SD”
  • Acid copper plating additive to FO-PLP/WLP, high current density for copper pillar formation
    “TORYZA LCN SP”
  • Acid copper plating additive for ultra-fine patterning formation
    “TORYZA LCN FRV”
  • Acid copper plating additive for Cu-Cu hybrid bonding
    "TORYZA LCN LXD"

Surface finishing technology to glass core substrates

  • Acid copper plating additive for through-hole filling to glass core substrates
    “TOP LUCINA GCS series”
  • Highly adhesive plating process on glass
    “TORIZING PROCESS”
URL
https://www.semicontaiwan.org/en

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