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2025.09.09Metal FinishingExhibitions

We will exhibit at Kyushu Semiconductor Industry Expo

We will exhibit at Kyushu Semiconductor Industry Expo.
We are looking forward to meeting you at our booth with the latest plating technology and products.

By visitor registration, admission fee will become free.
For more information, please visit the website below (only Japanese Language is avaiable).


okuno_booth_k-semi_en

Date

2025.10.8 Wed. to 9 Thu. 10:00 a.m. to 5:00 p.m.

Place

MARINE MESSE FUKUOKA, Hall B 【B8-18】

Content

Surface finishing technology to glass core substrares

  • Highly adhesive plating process on glass
  • Acid copper plating additive for through-hole filling to glass core substrates

Plating technology for wafer

  • UBM formation on aluminum electrode on wafer
  • Electroless plating equipment for wafer to make UBM
  • Acid copper plating additive for Cu-Cu hybrid bonding
URL
https://k-semi.jp/

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