2025.09.25ExhibitionsMetal Finishing

We appreciate your coming to SEMICON TAIWAN.

Thank you for dropping by the booth of OKUNO TAIWAN CO., LTD. at "SEMICON TAIWAN" from September 10 Wed. to 12 Fri. 2025.
OKUNO TAIWAN CO., LTD. introduced the latest surface treatment chemicals and process for semiconductor wafers, and glass core substrates.
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Content

Surface finishing and plating technology for semiconductor wafers

• UBM formation on aluminum electrodes on wafers,
  “TORYZA EL PROCESS”
• Acid copper plating additive to silicon interposer for high-aspect ratio filling
  “TORYZA LCN SV”
• Acid copper plating additive to micro-bump and trench filling
  “TORYZA LCN SD”
• Acid copper plating additive to FO-PLP/WLP, high current density for copper pillar formation
  “TORYZA LCN SP”
• Acid copper plating additive for ultra-fine patterning formation
  “TORYZA LCN FRV”
• Acid copper plating additive for Cu-Cu hybrid bonding
  "TORYZA LCN LXD"

Surface finishing technology to glass core substrates

• Acid copper plating additive for through-hole filling to glass core substrates
  “TOP LUCINA GCS series”
• Highly adhesive plating process on glass
  “TORIZING PROCESS”