2025.09.25Metal FinishingExhibitions

We exhibited at IPCA Expo 2025 in India.

We exhibited at "IPCA Expo 2025" in "electronica India 2025", held at Bangalore International Exhibition Centre from September 17 (Wed) to 19 (Fri), 2025.
At the booth, we exhibited the latest surface treatment chemicals and process technologies for various electronics applications such as printed circuit boards.
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Content

• To high current-density, fine patterning, Acid copper plating additive for via filling
  “TOP LUCINA NSV ADV”
• To large-diameter via, Acid copper plating additive for via filling
  “TOP LUCINA NSV LV”
• To large aspect ratio, Acid copper plating additive for soluble/insoluble anode
  “TOP LUCINA HLS”
• To high current density, Acid copper plating additive for through hole plating
  “TOP LUCINA MSD”
• Acid copper plating additive for via-filling and through hole filling
  “TOP LUCINA VT”
• Electroless Ni/Au and Ni/Pd/Au plating process for PWB, high connection reliability