2025.09.26Metal Finishing Exhibitions

OKUNO TAIWAN CO., LTD. will exhibit at TPCA Show -TAIPEI-

OKUNO TAIWAN CO., LTD. will exhibit at SEMICON TAIWAN to be held at TaiNEX 1, Taipei, Taiwan from October 22(Wed) to 24(Fri), 2025.
We will introduce the latest surface treatment chemicals and process for semiconductor wafers, and glass core substrates.
Free admission is available on the days of the show, so we look forward to seeing you there.
For more information, please visit the official website of "TPCA Show -TAIPEI-" .

Date

October 22 (Wed.) to 24 (Fri.) ,2025

Place

Taipei Nangang Exhibition Center(TaiNEX),Taiwan

Content

Surface finishing technology to glass core substrares

Highly adhesive plating process on glass
Acid copper plating additive for through-hole filling to glass core substrates

Plating technology for wafer and power modules

UBM formation on aluminum electrode on wafer
Acid copper plating additive to silicon interposer for high aspect ratio filling
Acid copper plating additive to micro bump and trench filling
Acid copper plating additive to FO-PLP/WLP, high current density for copper pillar formation
Acid copper plating additive for ultra-fine pattern formation
Acid copper plating additive for Cu-Cu hybrid bonding
Electroless plating process to dielectric substrate for power modules

The latest surface finish for IC substrates

Electroless copper plating process to solve Weak-Micro Via for high connection reliability
Acid copper plating additive for high-current density, fine pattern via filling
Acid copper plating additive for large diameter vias

The latest surface finishing for FPCs

For fine pattern formation, high joint reliability electroless nickel/gold plating process
Acid copper plating additive for high aspect ratio

URL

https://www.tpcashow.com/en/

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