2025.11.13Metal FinishingExhibitions

OKUNO TAIWAN exhibited at TPCA Show 2025 in TaiNEX（TAIWAN）.

Thank you for dropping by the booth of OKUNO TAIWAN CO., LTD. at TPCA Show 2025 in TaiNEX (TAIWAN) from October 22 Wed. to 24 Fri. 2025.

OKUNO TAIWAN CO., LTD. introduced;
- Surface finishing technology to glass substrates
- Plating technology for wafer and power modules
- The latest surface finishing for IC substrates
- The latest surface finishing for FPCs.

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Content

Surface finishing technology to glass core substrares

• Highly adhesive plating process on glass
• Acid copper plating additive for through-hole filling to glass core substrates

Plating technology for wafer and power modules

• UBM formation on aluminum electrode on wafer
• Acid copper plating additive to silicon interposer for high aspect ratio filling
• Acid copper plating additive to micro bump and trench filling
• Acid copper plating additive to FO-PLP/WLP, high current density for copper pillar formation
• Acid copper plating additive for ultra-fine pattern formation
• Acid copper plating additive for Cu-Cu hybrid bonding
• Electroless plating process for insulated heat dissipation substrate (for power modules)

The latest surface finish for IC substrates

• Electroless copper plating process to solve Weak-Micro Via for high connection reliability
• Acid copper plating additive for high-current density, fine pattern via filling
• Acid copper plating additive for large diameter vias

The latest surface finishing for FPCs

• For fine pattern formation, high joint reliability electroless nickel/gold plating process
• Acid copper plating additive for high aspect ratio