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2025.11.18Metal FinishingExhibitions

We will exhibit at SEMICON Japan 2025.

We will exhibit at SEMICON Japan 2025.
We look forward to welcoming you to our booth, where you can explore our latest plating technology and products for semiconductor post-processing.

By visitor registration, admission fee will become free.
For more information, please visit the website below.


okuno_booth_k-semi_en

Date

2025.12.17 (Wed.) to 19(Fri.), 2025

Place

TOKYO BIG SIGHT, East Exhibition Hall 6 【E6431】

Content

Surface finishing technology to glass substrates

  • Highly adhesive plating process on glass
  • Acid copper plating additive for through-hole filling to glass core substrates

Plating technology for semiconductor wafer and packaging substrates

  • Acid copper plating additives for semiconductor wafer
  • Acid copper plating additive for Cu-Cu hybrid bonding
  • UBM formation on aluminum electrode on wafer
  • Electroless plating equipment for wafer to make UBM
  • Acid copper plating additive for high-current density, fine pattern via filling
  • Acid copper plating additive for large diameter via filling

The latest plating technology

  • New mist CVD equipment (under development)
URL
https://www.semiconjapan.org/en

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