2025.12.23Metal Finishing Exhibitions

We will exhibit at IC & SENSOR PACKAGING TECHNOLOGY EXPO in NEPCON JAPAN.

We will exhibit at IC & SENSOR PACKAGING TECHNOLOGY EXPO in NEPCON JAPAN in TOKYO BIG SIGHT from January 21 (Wed.) to 23 (Fri.) 2026.
We will introduce OKUNO’s plating & surface finishing technology for semiconductors, IC substrates and printed circuit boards.

[Exhibition product]
・Highly adhesive plating process on glass
・Acid copper plating additive for through-hole filling to glass core substrates
・Acid copper plating additive for Cu-Cu hybrid bonding
・UBM formation on aluminum electrode on wafer and electroless plating equipment for wafer to make UBM
・New mist CVD equipment for next-generation power semiconductor：r-GeO₂

Please check the details and receive VISITOR BATCH from the official website of NEPCON JAPAN.
We are looking forward to seeing you soon.

Date

January 21 (Wed.) to 23 (Fri.), 2026

Place

Tokyo Big Sight, East 7 Hall, E30-18

Content

Surface finishing technology to glass substrates

Highly adhesive plating process on glass
Acid copper plating additive for through-hole filling to glass core substrates

Plating technology for semiconductor wafer

UBM formation for Al electrode on wafer
Electroless plating equipment for wafer to make UBM
Acid copper plating additives to semiconductor wafer
Acid copper plating additive for Cu-Cu hybrid bonding
Electroless plating process for insulated heat dissipation substrate (for power modules)

Plating technology for IC substrates

Electroless copper plating process to solve Weak-Micro Via for high connection reliability
Acid copper plating additive for high-current density, fine pattern via filling
Acid copper plating additive for large diameter via filling
Highly-reliable granular copper plating technology with high adhesion to molding materials

The latest surface finishing process

New mist CVD equipment for next-generation power semiconductor : r-GeO₂(under development)

URL

https://www.nepconjapan.jp/tokyo/en-gb.html#/

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