We appreciate you coming to 21th IC & Sensor Packaging Technology EXPO.
2019/1/16(Wed) to 18(Fri), We appreciate you coming to 20th IC & Sensor Packaging Technology EXPO.
Plating technology for the latest semiconductor packaging
- Ultra-fine Pattern Formation
- Additives for Acid Copper Plating to Fill Laser Through-hole "TOP LUCINA LTF"
- Electroless Copper Plating Process for Higher Connecting Reliability "OPC FLETPROCESS"
- Additives for Acid Copper Plating to Via-filling (For Fine Pattern) "TOP LUCINA FRV"
- For Ultra Fine Patterns, Additives for Acid Copper Plating to Via-filling "TOP LUCINA NPF"
- Pd Residue Removing Agent Applicable to Spraying Machine "OPC PALADELETE IF"
- Electroless Au Plating Process on Cu "TOP GILDPROCESS"
- Electroless Pd/Au Plating Process on Cu "TOP PALLAS PROCESS"
- Additives for Acid Copper Plating (For Wafer) "TOP LUCINA CP/SV/SD"
Plating technology for power device
- Electroless Ni/Au Plating Process for Al Electrode On Wafer "TOP UBP PROCESS"
- Electroless Nickel Plating Solution with Strong Crack Resistance and Great Solder Joint Performance "ICP NICORON LPW-LF"
- Electroless Ag Plating Process on Cu Substrates "TOP SILVE ACC"
Printed electronics - To build IoT community -
- Environmentally-Friendly PWB PROCESS "EF-PWB PROCESS"
- Cyanide-free, High-speed Electroless Copper Plating Solution "OPC COPPER NCA"
- Paste to Form Seed Layer for Electroless Plating "TOP ALP CP-1958"