We appreciate you coming to JPCA Show 2019.
2019/6/5(Wed) to 7(Fri), We appreciate you coming to JPCA Show 2019
Next-generation printed wiring boards, surface treatment for packages
- Ultra-fine Pattern Formation - L/S=1/1µm can be realized
- Additives for Acid Copper Plating (SAP, MSAP) For Via-filling Applicable to Fine Pattern "TOP LUCINA GAP"
- Additives for Acid Copper Plating to Fill Laser Through-hole "TOP LUCINA LTF"
- Nickel Seed Layer Forming Process Applicable tp FO-PLP Photosensitive Resin "TOP PSR PROCESS"
- Electroless Copper Plating Process for Higher Connecting Reliability "OPC FLET PROCESS"
- Final Surface Treatment Process without Nickel Plating, Electroless Pd/Au Plating on Cu "TOP PALLAS N PROCESS"
Surface treatment for FPC - For next generation high speed communication -
- Electroless Ni/Au Plating Process for FPC Boards to Roll to Roll Plating System "TOP RR PROCESS"
- To Flexible Printed Circuits for Patterns "Electroless Ni/Au Plating Process"
- Additives for Acid Copper Plating (MSAP) For Via-filling and Through-hole Plating "TOP LUCINA VT"
- Applicable for SAP Electroless Copper Plating Process to LCP Films "TOP LECS PROCESS"
Printed electronics - Toward the realization of IoT society -
- Environmentally-Friendly PWB Process "EF-PWB PROCESS"
- Cyanide-free, High-speed Electroless Copper Plating Solution / Paste Form Seed Layer for Electroless Plating "OPC COPPER NCA/TOP ALP CP-1958"
Surface treatment for power devices
- Electroless Ni/Au, Ni/Pd/Au Plating Process for Power Device "TOP UBP PROCESS"
- Electroless Nickel Plating Solution with Strong Crack Resistance "TOPUBP NICORON HR"
- Electroless Ag Plating Process on Cu "TOP SIVE ACC"