Plating on plastic process for decorative purpose Make palladium-tin colloids adsorbed on plastic surface To operate special conducting treatment, then conduct acid copper plating
Direct Acid Copper Plating Process
ABS, PC/ABS, General plastics, Polycarbonate(PC), Polyphenylene ether(PPE), Polyphenylene oxide(PPO)
Excellent in brightness, leveling, film properties High quality films come available Realize high leveling performance with high sulfuric-acid concentration bath Can use for high sulfuric-acid concentration bath High macrothrowing power can be realized
Excellent in brightness, leveling, film properties High quality films come available Realize high leveling performance with high sulfuric-acid concentration bath Can use for high sulfuric-acid concentration bath High macro-throwing power can be realized
Excellent in gold wire bonding performance Bath pH is neutral, can use for the substrates that are weak to acid and alkali Deposition speed is approx. 0.6 to 0.8 μm/h Easy wastewater treatment, not containing cyanide compounds High resistance against nickel impurities
Applicable to various dyeing bath pH Prevent dyeing bath spoilage, mold occurence No bad influences on dyeing and sealing performance Mold preventing and preservative agents are very safe (Approved by U.S. Food and Drug Administration）
Surface conditioner not containing nitric acid High permeability Prevent dyeing failure at interface of aluminum and resin Prevent uneven or leaking appearance caused by poor water rinse
Can obtain flexible films at wide current density areas Can obtain uniform appearances, prevent defects about appearances Can use platinum auxiliary anodes Excellent in electric potential stability and corrosion resistance Coumarin-free, formaldehyde-free
Can reduce pits High quality films can be easily obtained High-grade physical properties including malleability Less sludge, easy bath maintenance Excellent leveling ability comes available at wide range of current density
ECan reduce pits High quality films can be easily obtained High-grade physical properties including malleability Less sludge, easy bath maintenance Excellent leveling ability comes available at wide range of current density
Uniform semi-bright plating films with high corrosion resistance come available Reduce the impact on appearances by copper impurity accumulation Not containing coumarin, formalin
Uniform semi-bright tone, high leveling and covering power High-grade films can be obtained Reduce the impacts by additives from acid copper plating bathes Not containing coumarin, formalin
Can co-deposit insoluble ultra-fine patrticles Can obtain beautiful appearances regardless of co-deposition rate Prevent cloudy appearances, high corrosion resistance Can deposit at low-current density, dent areas uniformly Prevent blushing and burnt deposition in Cr plating steps Not damaging to black-color trivalent Cr plating color tones
Nickel Plating Additive For Micro-porous Chromium Plating
Excellent in corrosion-, chemical-resistance Excellent in anti-discoloration performance Small impact to film stress by bath aging High bendability, lead compound free (P content: high, 11 to 12% by weight)
Chelate-free cleaner Can use for steel, copper, brass substrates For anodic and periodic reverse pulse electro-cleaning Strongly remove buffing compounds and smut Not covered by PRTR regulation
Lead-free electroless Ni-Fe alloy plating solution Uniform alloy films (Fe content : 25％ by weight) can be obtained Excellent in shielding effect against low frequency magnetic waves Hardness:Hv700 (as deposited), Hv1050 (after heat treatment)
Additive for chromic acid-sulfuric acid etching bath Make adsorption state of catalysts uniform Improve deposition effect Strongly recommended for CRP PROCESS
Can decrease palladium concentration of catalysts Can use for a long time by replenishing Not containing formalin and strong complexing agents Easy wastewater treatment
Make copper immersion films uniformly on electroless- or strike electro-nickel films Promote smooth deposition of acid copper plating Prevent burnt deposits at contact points
Higher anti-bacterial, anti-virus than the films from hexavalent chromium plating bath Beautiful blue-black appearances by reducing yellow tones Hexavalent-chromium free bath High corrosion resistance
Highly precise zincate film can be obtained Suitable for thin aluminum electrodes as low aluminum dissolution Prevent zincate film unevenness before proceeding a next step
Dense zincate films can be obtained. High coverage of electroless nickel plating and uniform appearance is obtained Excellent in plating adhesion strength Less dissolution of aluminum, best for thin aluminum electrodes
Low erosion, maintain the brightness of aluminum electrodes Excellent degreasing and cleaning power Provide wettability to aluminum surfaces Low foaming, can use air agitation and spray
Can obtain uniform brightness and high levelling power at wide current density areas Great ductility, suitable for second processing Best for undercoat nickel plating
Can obtain uniform brightness, high levelling power at wide current density areas Great ductility, second-processing is possible Suitable for underlying nickel plating films for PWB
Copper paste for plating seed layer by screen printing Can use by low-temperature curing in air Excellent in deposition of electroless plating Achieve high adhesion between substrates and plating films
Catalyzing Agent
General plastics, Polyethylene terephthalate(PET), Polyimide(PI)
Neutral type electroless gold plating solution Sulfite based, cyanide free product High deposition performance on high P content electroless nickel plating films High deposition performance on palladium plating films
Realize high corrosion resistance by small thickness High current efficiency, high deposition performance Stable nickel rate under wide current density Excellent in hydrogen permeation Great covering abilty, realize uniform deposition
Very strongly remove animal-, vegetable-, mineral fat and oils Make stable emulsion with hydrochloric acid, sulfuric acid, phosphoric acid Inhibit corrosion by acids High emulsion and immersion performance Easy bath control, increase work efficiency Not containing endocrine disrupting chemicals
Strong cleaning power, reduce treatment time Long bath life, economical product Eco- and human-friendly, no need for special equipment Not containing endocrine disrupting chemicals
Excellent cleaning power to mineral, animal, vegetable oil, fats and dirt Can use for a long term by filtration Not containing endocrine disrupting chemicals
Plated films with several-micron micropores can be formed Maintain porous structures continuously, reduce the impact by current density Can form the porous films immediately, short-time plating is possible
Uniform silver white appearance Anti-bacterial effect continues Strong water resistant property, no discoloration Not containing cyanides (sulfuric acid based product) Can use as Sn-Cu alloy plating as the replacement of nickel plating
Auxiliary agent for bright nickel plating Strongly promote the effectiveness of a primary brightener Prevent poor brightness at high current density areas Maintain the properties of electrolysis deposits
Containing formalin, only use one component Can reduce by-products from decomposition Can extend the interval of activated carbon treatment Easy bath control Best for plating on plastic
Brighteners for semi-bright tin, semi-bright solder plating Work at wide current density areas Excellent in covering power at low current density areas
Improve catalyst adsorption ability to plastic surface Make palladium catalysts adsorbed uniformly Improve the stability of deposition performance Tolerant against chromic acid drag-in
Alkaline-type electroless nickel plating solution Can obtain high P content film (P content: 8 to 10%) High corrosion resistance Prevent nickel film dissolution aroung contact points Excellent in selective deposition performance Prevent the deposition to jigs Can decrease nickel concentration, economical product
Alkaline-type electroless nickel plating solution for TOP ZECROM PLUS PROCESS Excellent in deposition reaction, prevent no-deposition defects High bath stability, a long bath life Lead-free
Alkaline-type electroless copper plating solution Can obtain high P content film (P content: 8 to 10%) High corrosion resistance Prevent nickel film dissolution aroung contact points Excellent in selective deposition performance Prevent the deposition to jigs Can decrease nickel concentration, economical product
Excellent leveling performance of acid-copper plating Improved continuity of conductive films Strong bath stability to prevent copper deposition on tanks, bath decomposition Can use for a long time by replenishing Not containing formaldehyde and strong chelating agents Improve working environment, easy wastewater treatment
Make palladium catalysts adsorbed uniformly in catalyzing steps Control excessive catalyst adsorption on plastic For ABS resin, conditioning steps become unnecessary Control palladium catalyst amount adsorbed on jigs
Alkaline-type electroless nickel plating solution Ammonia-free, excellent in corrosion resistance Prevent conductivity failure caused by no deposition on jigs Control electroplating film dissolution No need to increase the thickness of electroless nickel plating films (High P content, P content 8 to 10%)
Sn-Cu alloy plating bath, not containing lead Can use as lead free solder plating Can obtain stable alloy ratio at wide current density areas (Cu content:1 to 2% by weight)
Various Electroplating ChemicalTin-Copper Allloy Plating
Tin-copper alloy plating bath, not containing lead Can use as lead free solder plating Can obtain stable alloy ratio at wide current density areas (Cu content:1 to 2% by weight)
Various Electroplating ChemicalTin-Copper Allloy Plating
Lead-free, tin-copper films can be obtained Can use as the replacement of lead-based solder plating Can obtain stable alloy ratio (Cu content: 1 to 2 % by weight) at wide current density areas
Various Electroplating ChemicalTin-Copper Allloy Plating
Immersion-type electroless silver plating solution for copper Acidic bath, deposition rate 0.2μm/15min No voids between copper and silver Can obtain high adhesion silver films High bath stability
High deposition performance, great adheison to LCP Flat and smooth films come available, prevent blisters and peel-off High bath stability, a long bath life
Uniform palladium adsorption power to LCP Alkaline-product, prevent haloing more strongly than acidic-type High penetrating performance to small-diameter holes
Lead-free product High deposition performance High film hardness is available without heat treatment The most suitable for electronic components and ceramics Can use continuously by replenishing (B content: 0.2 to 0.6% by weight)
For batch application, lead-free product Excellent in deposition performance High film hardness without heat treatment Best for electronic components and ceramics
Lead-free product High deposition performance High film hardness is available without heat treatment The most suitable for electronic components and ceramics Can use continuously by replenishing (B content: below 0.2 to 0.6% by weight)
Acid copper plating additive for through-hole filling for glass subustates. Acid copper plating additive for pulse electrolysis, ideal for high-aspect-ratio through-hole filling Strongly suppress the deposition near hole opening and prevent voids Additive performance is stable, realize high-quality plating
Acid copper plating additive for through-hole filling for glass substrates. Pre-filling additive for acid copper plating before through-hole filling It fills the inside of the hole with copper, greatly reducing the risk of voids in the next filling plating process. Even when using pulse electrolytic plating, it maintains a lustrous appearance over a wide range of electrolytic conditions.
Lead compounds are not used Deposition rate can be maintained and the bath can be used over 10 MTOs After 10th MTO, crystals are generated by cooling the bath The bath can be used up to 20 MTOs by removing the crystals periodically Deposit is excellent in brightness and leveling performance Deposite indicates compressive stress The bath can be used over 10 MTOs even when iron castings are treated
Trivalent chromium plating solution that produces a colour tone (blue-white) very close to the appearance of hexavalent chromium plating and is environmentally friendly, containing no harmful hexavalent chromium
Lead compounds are not used High hardness (about Hv700) without heat treatment. P content is 1 to 2 % by weight Good wear resistance Long-term use is possible by replenishment method
Grey-color trivalent chromium plating solution More black-tone than TOP FINECHROME LG High corrosion resiatance High covering performance Stably deposit in mass-production
Silicon carbide/nickel composite plating solution Low phosphorus type films come available (P content: 1 to 3％ by weight) Excellent in film hardness (Hv700 to 750) Excellent in wear resistance Higher film hardness can be obtained after heat treatment Can be used continuously Maintain almost the same film properties from an initial-make up time to 2, 3 MTO
Maintain deposition rate regardless of bath aging Excellent in brightness, leveling performance Inner stress is compressive Not use lead compounds Can use for a long time by cooling bath to remove impurities
Lead compound free Compliant with PFOS and PFOA regulations PTFE co-deposited amount: 7 to 13 % by volume Low coefficient of friction, excellent sliding properties Non-adhesiveness, excellent in mold releasing property High peelability, water repellency, and oil repellency Reduce dimple amount
Pb compound free PFOS, PFOA free product PTFE co-deposition content: 20 to 26% by volume Low coefficient of friction, high sliding performance Not adhesive film High mold-releasing, water repellent, oil repellent performance Can use for 2 to 3 MTO, maintain PTFE content
Pb compound free PFOS, PFOA free product PTFE co-deposition content: below 30 to 40% by volume Low coefficient of friction, high sliding performance Not adhesive film High mold-releasing, water repellent, oil repellent performance Can use for 1 to 2 MTO, maintain PTFE content
Electroless Ni-P/PTFE composite plating solution (P content:1 to 3 ％ by weight, PTFE co-deposition content: below 5% by volume) High hardness, Hv650 to 700 Pb compounds, PFOS, PFOA free product Low coefficient of friction, high sliding performance Not adhesive film High mold-releasing, water repellent, oil repellent performance Can use for 3MTO, maintain PTFE content
Middle P content, electroless Ni-P plating solution Maintain deposition rate regardless of bath aging Excellent in brightness, leveling Film stress is compressive Not containing Pb, Hg, Cd, Cr, Bi (P content: 6 to 9% by weight)
High P content, electroless Ni-P plating solution Excellent in chemical resistance, discoloration resistance Film stress is compressive Not containing Pb, Hg, Cd, Cr, Bi (P content: over 10% by weight)
Can obtain Ni-PTFE electroplating composite films (PTFE co-deposition content: maximum 60% by volume) PFOA, PFOS-free Can handle easily by adding watts nickel bath
Electroless Ni-P/PTFE co-deposition plating solution PTFE co-deposition content: 30 to 40% by volume,very high type Lead-free, PFOS, PFOA compound free product High sliding-, mold-releasing performance High water repellent performance
Electroless Ni-P/PTFE co-deposition plating solution PTFE co-deposition content: 6 to 13% by volume,middle type Lead-free, PFOS, PFOA compound free product High sliding-, mold-releasing performance High water repellent performance
Can obtain semi-bright bismuth-antimony alloy plating films (Sb content: 5 to 10 mass%) Higher film hardness and sliding performance than bismuth plating films
Improve corrosion- and disciloration resistance of electroless Ni-P plating films Not containing chromium, easy wastewater treatment Improve adhesion toward water-, solvent-based coats No impact on plated appearance Better corrosion resistance than hexavalent chromating (when small thickness)
Lead-free product from TOP NICORON TOM Excellent in covering performance Can maintain deposition speed and brightness in continuous use Improve working performance (P content: middle, 7 to 9% by weight)
Can maintain deposition speed in continuous use Excellent in corrosion-resistance and anti-discoloration performance (P content: middle, 8 to 10% by weight)
Excellent in corrosion-, chemical-resistance Excellent in anti-discoloration performance Reduce film stress increase even if MTO proceeds (P content: high, 11 to 12% by weight)
Excellent in corrosion-, chemical-resistance The most suitable for parts requiring non-magnetic property For non-magnetic purposes such as plating on resistors (P content: 12 to 13% by weight)
High P content, electroless Ni-P plating solution For non-magnetic property Little change by time lapse Great smoothness, high chemical resistance For thick plating (P content: 11 to 12% by weight)
Middle P type, electroless Ni-P plating solution Excellent in brightness, covering performance Can maintain brightness in continuous use (P content: 8 to 10% by weight)
Lead-free product from TOP NICORON TOM Excellent in covering performance Maintain deposition speed and brightness in continuous use Improve working performance (P content: 7 to 9% by weight)
Middle P content, electroless Ni-P plating solution Can maintain deposition speed in continuous use Excellent in corrosion-resistance and anti-discoloration performance (P content: 6 to 10% by weight)
Lead free electroless nickel plating solution from TOP NICORON SA-98 Excellent in corrosion-, chemical-resistance, bath stability Excellent in anti-discoloration performance (P content: high, 10 to 11% by weight)
High P content, electroless nickel plating solution Excellent in corrosion-, chemical-resistance Excellent in anti-discoloration performance Reduce film stress increase even if MTO proceeds (P content: high, 11 to 12% by weight)
Low to middle type, electroless Ni-P plating solution Can use at a low bath temperature (65 to 75℃) Can maintain deposition speed in continuous use (P content: 4 to 7% by weight)
Low to middle P type, electroless Ni-P plating solution Can use at a low bath temperature (70 to 80℃) Maintain deposition rate regardless of bath aging (P content: 5 to 7% by weight)
Lead-free version from TOP NICORON LPH Low P content High film hardness without heat treatment High wear resistance (P content: low, 1 to 2% by weight)
Low nickel concentration, can reduce chemical cost for initial-make-up Excellent in corrosion resistance, chemical resistance, discoloration resistance (P content: 11% by weight)
Not containing cyanides, chelate compounds Easy for waste water treatment Strong cleaning power, can use for a long term by filtration Not containing endocrine disrupting chemicals
Nitric acid, nitrogen-free Can strip plating tank and passivate stainless steel tank within 12 hours Reduce harmful gas generation, weak odor, improve working environment
For Electroless Nickel Plating Films (For Dipping)
Strong cleaning power to shorten treatment time Prevent discoloration of copper and brass by alkali Prevent excessive dissolution of zinc Easily washed off Not containing endocrine disrupting chemicals
Treatment Chemical for Copper and Its AlloysSoak Cleaner
Use to strip tin, solder, tin-lead alloy plating films on copper and copper alloys Fluoride-, hydrogen peroxide free-product Not damage to copper and copper alloys
Use as electro-cleaner for copper, brass lead frames Strong cleaning power, no damage substrates Chelating-agent free product Easy wastewater treatment
Treatment Chemical for Copper and Its AlloysElectrolytic Cleaner
Reduce damage to aluminum, protect original aluminum texture Low foaming, can use air agitation and shower Strongly remove various fat and oils Excellent in biodegradability, ecp-friendly product
Strong cleaning power to various kinds of aluminum Can use aged sullfuric-acid based anodizing baths Long bath life, economical product Can remove cutting oils, mold lubricants in a short time Not containing endocrine disrupting chemicals and heavy metals
Nickel acetate based sealing solution Can add antimicrobial properties to anodized aluminum Fast-acting antimicrobial effect on both gram-positive and negative bacteria Strongly prevent blooming, excellent in sealing performance Can obtain high-class dyed appearances
Roughen aluminum surface by micron-level Can use only by immersion treatment Realize high to super water repellent performance Protect aluminum from excessive dissolution
Excellent in etching effect, promote aluminum dissolution Fine silver-white appearances come available Prevent the occurrence of clinker (solid aluminum hydroxide)
Use for nicke- acetate based sealing solutions Reduce wiping steps in post-treatment Prevent blooming caused by impurities such as dissolved aluminum Can extend bath life Chelate-free product for easy wastewater treatment
Use for dipping treatment Can remove powdering, blusing, dirt after sealing treatment Maintain the original colors of treated substrates Long bath life, can be used continuously
Post-treatment Agent for White Powdery Bloom Prevention
Use for boiling water sealing Completely prevent powdering, blusing appearances or rainbow (interference) tones Suitable as aid agent for TOP SEAL L-100
Sn-Ni base coloring agent Bronze color with strong yellow tone can be obtained Short time treatment is possible, improve productivity Control range is wide, high bath stability, easy bath maintenance Can use for low reflectance process for aluminum (TOP ALQUROY PROCESS)
Activate high-silicon aluminum alloy surface, can obtain anodic oxide films that can be easily dyed Uniformly dissolve cast surfaces even for complex shapes, protect substrate surface Suitable for casting and die cast alloys from solid solution treatment, can obtain bright polished surface NOx gas emissions can be suppressed Economical product by adding powder
Strong cleaning power to various kinds of aluminum Can remove cutting oils, mold lubricants Uniformly dissolve segregation layers without damaging aluminum Can use aged sulfuric-acid based anodizing bath, eco-friendly products
Anodizing and coloring process for aluminum alloys (die-casting and casting parts) ADC12 can't be dyed easily but TOP ADD PROCESS can make colored oxide films uniformly on aluminum alloys like ADC12, die-casting and casting parts.
Anodizing and Coloring Process for Aluminum Alloys (Die-casting and Casting)
Can make films having low electrical resistance and high corrosion resistance Film specifications can be selected by treatment temperature and treatment time High adhesion power to coating films Chromic-acid free product
Chemical Conversion Chemical for Magnesium and Its Alloys (TOP MAGSTAR Process)Chemical Conversion Agent
Alkaline-type electroless nickel plating solution for TOP ZECROM PLUS PROCESS Excellent in deposition reaction, prevent no-deposition defects High bath stability, a long bath life Lead-free
Improve catalyst adsorption ability to plastic surface Make palladium catalysts adsorbed uniformly Improve the stability of deposition performance Tolerant against chromic acid drag-in
Good solder wettability and solder joint strength, and excellent gold wire bonding properties A dense, uniform-appearing film can be obtained on nickel and palladium films Almost no corrosion of the underlying nickel
A dense, heat-resistant palladium film can be obtained without affecting the underlying nickel Gold plating on palladium provides excellent solderability and gold wire bonding Can be used continuously for up to 2 MTO Neutral bath, little damage to the base material, cyanide compound free
Acid copper plating additive for semiconductor High filling poerformance to blind via hole Applicabler to treanch filling High filling performance by small thickness
Immersion-reduction type electroless gold plating solution Prevent the corrosion of the underlying nickel plating films For low phosphorus and medium phosphorus type electroless Ni-P plating Dense plating films is obtained over nickel and palladium plating films High solder wettability and solder joint strength, excellent in gold wire bondability
Immersion-type electroless gold plating solution For middle-phosphorus type nickel plating films Reduce the corrosion of base nickel plating films Dense gold plating films can be formed High solder wettability and solder joint strength
Cyanide-free, neutral type electroless palladium plating solution Palladium purity over 99wt% (P content:below 1%) can be obtained Dense palladium plating films can be obtained without damaging underlying nickel plating films Excellent solderability and gold wire bondability by nickel/palladium/gold plating films
Sulfur-free, low phosphorus type (P content: 1.5 to 2.5 % by weight) electroless Ni-P plating solution Suitable for power semiconductors that require high temperature bonding and regular use at high temperatures. Excellent crack resistance and less film embrittlement even after heat treatment over 400°C
Sulfur-free low phosphorus type electroless nickel solution For power semiconductors that require high-temperature bonding For power semiconductors that are used at high temperatures Excellent crack resistance even after heat treatment at 300 to 350°C Minimal degradation of solder wettability over time (P content:2-3wt%)
Strongly remove fingerprints, oil, rust from copper surface Acidic-type, have cleaning power with etching effect Not containing PFAS, endocrine disrupting chemicals
Can use for the substrates that are weak to allkali Easily remove foams after cleaning Can use at a lower temperature to save energy cost Not containing PFAS, endocrine disrupting chemicals
The OPC FLET process is an electroless copper plating process that is compatible with semi-additive methods. It has excellent uniform deposition on the material surface and inside via holes, reduces circuit width narrowing during flash etching, and also suppresses precipitation on copper, achieving crystal continuity between inner layer copper and upper layer plating copper. This process is ideal for forming fine patterns and micro via holes on IC substrates, suppressing the generation of voids.
The OPC FLET-S process is an electroless copper plating process suitable for the subtractive method, MSAP. Excellent for uniform deposition on the material surface, via holes, and through holes, reducing circuit width narrowing during flash etching, and suppressing precipitation on copper, resulting in continuous crystal formation between inner layer copper and upper layer plating copper This is the optimum process for improving reliability by realizing reliability.
Via filling additive that enables high current density plating in fine-pattern PWBs Ideal for large diameter vias of PWBs due to its excellent filling performance
Via filling additive that enables high current density processing for fine pattern PWBs Ideal for pattern plating of build-up layers where uniformity of film thickness is important Plating by vertical conveyor continuous plating system at 2~3 A/dm2 is possible
High throwing power, suitable for high-aspect-ratio substrates Excellent via covering power for PCB with via- and through-holes Can use phosphorus-containing copper anodes and insoluble anodes
Improve covering performance into through and via holes Excellent in penetration power into small holes Suitable for horizontal conveyance plating system (Batch treatment is possible)
Use after OPC-1200 EPOETCH step Strongly clean etched surface of epoxy resin Excellent in permeability to small holes and areas Not containing PFOS, PFOA, endocrine disrupting chemicals
Use with OPC-1200 EPOETCH, sodium permanganate based solution Can use for de-smear to clean inner copper foils Make concave and convex surfaces finely on epoxy resin
High folding endurance Deposition rate 12μm/h (P content: 7 to 11% by weight) Prevent blackening and corrosion after stripping immersion gold plating Excellent in solder wet and solder joint performance Fine pattern and semi-bright appearance can be obtained
Cleaning and conditioning epoxy surface after micro-etching Strong permeability into micro-holes and small areas Low-foaming, can use de-smear equipment by conveyance system
Reduce time for roller maintenance from acid-type catalyst process Excellent permeability into small holes Can shorten treatment time Strong adsorbing power of catalysts to PWBs Reduce Pd concentration at the time of initial make-up to 50%
Neutral-type cleaner Remove oxidized films and resist residues from copper surface Improve wettability, high cleaning power Can be washed easily by water rinse Not containing PFOS, PFOA, endocrine disrupting chemicals
Reduce damage to copper substrate Strongly remove organic and inorganic dirt by spray or immersion Strongly remove protective films, solder resists, dry films and various residues Can use for pretreatment before electroplating Can use at a low temperature to save energy costs Not containing PFOS, PFOA, endocrine disrupting chemicals
Use after OPC-1200 EPOETCH step Strongly clean etched surface of epoxy resin Excellent in permeability to small holes and areas Not containing PFOS, PFOA, endocrine disrupting chemicals
Promote catalyst adsorption evenly High deposition performance to substrates that can't be plated easily Weak alkaline based, can use for substrates that can't be treated by alkali Excellent permeability into small-diameter blind via holes High cleaning performance to copper foils
Not containing sulfur and lead compounds (Apart from sulfuric acid and sulfate ions) P content 3 to 4％ by weight, film density 8.5/cm3 Excellent in fine pattern formation performance Not make passivate films easily Prevent solder wettability decrease by oxidation Reduce solder diffusion into nickel
High covering performance, uniform deposition by small thickness Deposition rate 0.15μm/2min Excellent in fine patterning formation performance High solder joint, high gold wire bonding performance
Deposition rate: 12μm/h P content: 7~11wt Blackening and corrosion are unlikely to occur after Au plating is peeled off Fine pattern formation performance Excellent in solder wettability and solder joint strength
Selectively remove copper sputtering films Neutral type bath, prevent pattern width reduction Suppresse the increase in circuit surface roughness Control undercut Spray treatment is recommended
Promote catalyst adsorption on hole wall, resin, glass fiber Can omit anionic pre-dipping step High connection reliability with inner copper foils Prevent foaming by agitation or bath circulation
Stabilize catalyst adsorption in alkaline-ionic catalyzing step Give wettability, improve penetrating performance into small-diameter holes Control the amount of residues on copper High connection reliability with inner foils
High connecting reliability with inner copper foil and plated copper Can obtain copper film with small thickness stably Great deposition performance into via-, through-holes High adhesion power on low Ra materials, prevent blisters High purity copper is available Low sheet resistance is possible even by small thickness
Acidic treatment agent to prevent deposition of electroless nickel plating into non-conductive holes in PWB Prevent electroless nickel deposition out of patterns
Electroless copper plating solution, rochelle salt based Can obtain smooth and bright appearances Suitable for rolled copper foils to prevent nodules after acid copper plating
Reduce damage to nickel films Fine and uniform film appearance can be obtained High solder wettability and solder joint strength Can use at a low temperature (0.06μm/10min at 80℃)
Use as pretreatment for isolated circuit patterns Use after accelerating step Prevent electroless nickel deposition out of patterns Excellent in fine pattern formation performance
For pretreatment to isolated circuit patterns Use after Pd acceleration to remove palladium from surfaces High selectivity only to copper electrodes Excellent in fine pattern formation performance
Auto-catalytic type electroless palladium plating solution Palladium purity over 99％ (P content below 1%) is possible Great bath stability, tolerant against dragged-in impurities High solder-joint and heat-resistant gold wire bonding performance can be obtained after immersion gold plating on PALLATOP LP film Neutral bath, reduce damage to substrates Cyanide-free products
High solder wettability, solder joint strength and gold wire bonding performance Best product for electroless Ni-P/Pd/Au process Stable deposition performance, can obtain uniform deposits on palladium films High deposition performance (0.1μm/25min, on 0.1μm of palladium film) Prevent base film corrosion
High filling performance even in horizontal R to R equipment Solve the problem of reduced filling performaance due to weak current generated between the copper sulfate plating tank and the conveyyaance rollers
Wet-, Plating-Process Chemical for Polyimide Films Applicable to FCCL
Electrolytic stripping agent for jigs used in plastic metallization Can strip copper, nickel films from stainless or titanium jigs Prevent damage on jigs, reduce sludge amount
For Copper/Nickel Plating Films (For Electrolysis)
Can remove palladium from PVC jigs Prevent deposition on jigs in electroless plating steps The most suitable for the lines where nictric acid can't be used
Can obtain copper plating films with high adhesion power on neodymium magnets Alkaine-type product, not damaging to neodymium magnets Not containing cyanides
Excellent fine patterning performance, selectively activates copper circuits Low palladium concentration, little corrosion to copper, long bath life (Pd 7 mg/L). Little effect on adhesion of liqui-type d solder resists
Can analyze electroless nickel plating bath Can control nickel concentration and pH automatically Have USB ports to connect with computers Can save data into USB by installed intervals
Glossy finishing as if polished by chrome green oxide bar Containing ultra-micro alumina Chromium-oxide free, not covered by PRTR Substitution product for chrome green oxide bars
Use after etching step to reduce chromic acid remaining on resin surfaces Control the impact by chromic acid in catalyzing steps Make adsorption condition of catalysts uniform on resin surfaces
Substitution product for chrome green oxide bars Containing ultra-micro alumina Chromium-oxide free, not covered by PRTR Excellent in brightness and cleaning power
Can work for a long time, have great cutting power Round shape with 50 mm diameter and 200 mm length Suitable for sisal buff, applicable to automatic polishing equipment
Use only for replenishing to increase chemical nickel concentration Can reduce drag-out amount just after replenishing Effective in terms of wastewater treatment and production costs
Excellent in bath stability for a long time use High-speed deposition, film brightness can be maintained Not easily damaded by scratched, prevent burnt deposition
Excellent in covering performance at low currect density areas High brightness and leveling performance can be obtained Excellent in covering performance in chromium plating step
Powders can be co-deposited uniformly in low current density, bottom areas of substrates Can reduce the consumption amount of powders Realize beautiful appearances and high corrosion resistance together
Nickel Plating Additive For Micro-porous Chromium Plating
Strongly remove buffing compound residues and smut Easy wastewater treatment, can be used for a long time Also can use as cleaner or rust-remover by electrolysis degreasing Use for anodic, cathodic and PR electrolytic cleaning for iron, copper, brass substrates
Can reduce palladium consumption amount Can maintain tin (II) chloride within 50 to 60 g/L Uniform adsorption performance can be obtained High tolerance to chromic acid Easy bath control
Can obtain uniform brightness, levelling performance at wide current density areas Great ductility Reduce bad effect on film properties by excessive addition Easy bath control
Use for iron and nonferrous materials by cathodic electrolysis Strongly remove scale, smut and rust Standard condition for nonferrous materials, TOP CLEANER E 30 to 60 ml/L With sodium hydroxide, 10 to 40 g/L
Can obtain cobalt-phosphorus-chromium alloy films Smoke color films can be obtained By combination with TOP FARBE COB-DIP2, black color films can be obtained
For electro-degreasing to iron, copper, copper alloy Cyanide-free product For iron substrates, anode and PR electrolysis is possible For primary, intermediate, final electro-degreasing
Use as electro-cleaner, chelating-agent free product Also can use for electro-rust remover Can use steel, copper, brass For anode-, cathode, PR electrolysis cleaning
Beautiful blue-black tone can be obtained Reduce yellow tone Excellent in covering and deposition performance High corrosion resistance, high tolerance to salt damage (L* 58, a* 0.2, b* 1.7)
Light tone, white appearances can be obtained Similar to hexavalent chromium plating films Very excellent in covering and micro-throwing power (L* 81, a* -1.2, b* 0.6)
Use with ACNA B-10 and NICKEL CAREER Excellent in leveling performance, brightness Uniform, smooth deposits can be obtained at wide current density areas
Can obtain Ni-P alloy plating films Show high corrosion-, chemical-resistance, excellent in wear resistance High bath stability, long bath life P content: 10 to 12mass%
Make nickel, copper impurities settled in trivalent chromium plating bath Use with activated carbon treatment Removal capacity Nickel drops from 20mg/L to 1mg/L Copper drops from 1mg/L to undetectable level
Excellent in covering, leveling performances Uniform brightness can be obtained Best for substrates that are processed after plating Can use for rack, barrel plating
Can obtain bright films High levelling and covering performance, great ductility can be obtained By controlling additive amount, can use for through hole plating to PWB Also can use for decorative plating
Use for copper pyrophosphate plating bath (for barrel plating) Excellent in covering power Can obtain high brightness and leveling power at wide ranges
Cyanide-free, acid-type copper-tin alloy plating solution Similar appearances with nickel plating films Non-magnetic, deposition rate is faster than conventional products Thick plating (over 10μm) is possible Can control alloy ratio by changing Tin () sulfate concentration
Additive for sulfuric-acid base tin plating solution Use for rack and barrel plating Tin concentration range and brightness range are wide Excellent in uniformity, leveling performance Great soldering performance comes available
Bright Sn-Ni alloy plating solution For acidic, fluoride-base bath Excellent in current efficiency, micro-throwing power Can be used by various balance bathes Thick plating is possible
Additive for alkaline tin-nickel alloy plating solution For alkaline, pyrophosphoric-acid base bath Excellent in current efficiency, micro-throwing power Color tones like stainless steel can be obtained Easy for wastewater treatment
For steel, alloy 42, lead frames, hoop substrates and general cleaning Alkaline-type product Containing phosphorus, not make silicate films Low COD product
Treatment Chemical for Steel and Alloy 42 MaterialsSoak Cleaner
Use for copper alloys, iron-nickel alloys Can peel lead-free (Sn-Bi, Sn-Cu, Sn-Ag）solder plating films Strongly protect substrates from encroachment Excellent in appearances after peeling Hydrogen-peroxide free, halogen-free
Lead-free electroless nickel-phosphorus plating solution Excellent in fine pattern forming performance High solder wettability and solder joint strength Can use at 65℃, best for MID P content: 5% by weight
Electroless Plating Process Chemical for MIDElectroless Nickel Plating Solution
Electroless copper plating solution for MID Cyanide-free, EDTA-based product for strike plating High pattern selectivity, great deposition performance Applicable to MID by LDS structure
Electroless Plating Process Chemical for MIDElectroless Copper Plating Solution
Electroless copper plating solution for MID Cyanide-free, EDTA-based product High bath stability, high speed plating is possible (5μm/h) High selectivity to copper
Electroless Plating Process Chemical for MIDElectroless Copper Plating Solution
Buffing aid generally called as oil bar or lublicating oil Have lublicating effect Prevent overheating in buffing work Prevent burnt appearances and obstruction of buffing equipment Extend the life of buffing equipment
Solid-type buffing compound for automatic buffing machine Have strong cutting power, LIME-type product for intermediate polishing Can apply easily, can use for a long time Shiny finishing is possible Buffing compound residue can be removed easily
Great cutting power LIME-type buffing compound for intermediate polishing Can apply easily, can use for a long time Suitable for sisal-, cotton-buff polishing
For intermediate finishing Have great cutting power, LIME-type buffing compound Can apply easily, have use for a long time Suitable for sisal-, cotton-buff polishing
Standard LIME buffing compound Great cutting power, realize shiny appearance Can be removed easily in degreasing steps Suitable for intermediate finishing
Containing aluminum oxide and fat, LIME type product Can adjust hardness if mixed with kerosene or machine oil Can apply buffing compounds directly on metals Buffing compounds will not be scattered easily and can be removed easily
Use for Sargent bath, fluoride-free Improve current efficiency and film properties Use TOP HARD CHROME HE-2R (containing chromic acid) for replenishing
Masking reagent for plating Have great heat-, acid, alkaline-resistance Tough films can be obtained, but easily removed Not give bad effects on electroless nickel plating solutions
Excellent in corrosion-, chemical-resistance The most suitable for parts requiring non-magnetic property For non-magnetic purposes such as plating on resistors (P content: high, 12 to 13% by weight)
Excellent in covering- and anti-discoloration performances, brightness Containing nickel chloride For batch application Lead-free product from TOP NICORON VS-C (P content: middle, 8 to 10% by weight)
Excellent in brightness, anti-discoloration performance Can use for various purposes For batch application Lead-free product from TOP NICORON Q-2 (P content: middle, 7 to 9% by weight)
Chemical polishing for iron substrates Containing fluorides, also can use for burr removal Hydrogen peroxide is added separately so suitable for overseas
Chemical polishing solution for steel materials Containing hydrogen peroxide and fluorides Batch application type Best product for de-scaling, activation and deburring
Concentrated solution to make alkaline zinc bathes Containing zinc 160g/L, sodium hydroxide 530g/L By adding necessary amount of sodium hydroxide, can make alkaline zinc bathes easily
Clear and beaautiful appearances come available Chelate-agent free, so easy for wastewater treatment Heavy metals can be removed easily in wastewater treatment Can use under high current density Suitable for the substrates that have post-processing treatment
Clear appearances comes available Chromating can be conducted beautifully Chelate-agent free Heavy metals can be removed easily in wastewater treatment Can use under high current density Suitable for the substrates that have post-processing treatment
Use after silver solder stripping step to lead frames Use for water dripping and finishing to copper-, copper-alloy lead frames Benzotriazole derivative free Weak-alkaline product
Use for silver solder stripping to lead frames Use for water-dripping and finishing to copper and copper alloys Benzotriazole derivative free product Acidic type product
Use as electro-stripping agent for silver plating films on copper and its alloy Have etching effect, auto-decomposition is prevented Succinimide-, cyanide-free product Easy wastewater treatment
Use as nickel stripping agent for iron, copper, copper-alloy Also for nickel-silver (copper-nickel-zinc alloy) Cyanide-free product, protect substrates
Can strip tin, tin-lead alloy plating films on copper and its alloys Have wide control range, can use by automatic plating system Suitable for stripping solder plating films from PWB or jigs
Use for anodized aluminum Excellent in sunlight resistance Have high dyeing ability, long bath life By adjusting color balance, various color tones can be obtained Can use for low reflectance process for aluminum (TOP ALQUROY PROCESS) Heavy-metal free dyes are available
Sealing agent for building materials Use in line having filtering system Prevent the occurrence of stains in drying steps Long bath life, excellent in sealing power
Promote the dissolution of aluminum strongly Increase etching effect significantly Also suitable for graving Strong matte tone comes available uniformly
Aqueous dispersion containing PTFE Use for hard-anodized substrates Use for unsealed aluminum substrates By attaching PTFE particles on surfaces, improve initial sliding-, lubricating performance
Aqueous dispersion containing PTFE Use for sealed substrates by nickel-acetate based bath By attaching PTFE particles on surfaces, improve initial sliding-, lubricating-performance
Nickel and metal-free sealing agent Can maintain discoloration in sealing steps Can obtain sealing performance equivalent to nickel-acetate based sealing
Use with TOP NF SEAL S-205 for dyed aluminum parts Promove TAC DYESTUFF fixing into anodized films Prevend dye bleeding in sealing steps Not decrease corrosion reistance after sealing step
The most suitable for aluminum substrates As the pretreatment before electroless nickel plating Have micro-etching effect Strongly improve adhesion power and appearances to various substrates
Excellent in adhesion power, suitable for undercoating of electroless nickel plating Concentrated type, cyanide-free product Can reduce disposal amount of zincate bathes in replenishing time
Can make films having low electrical resistance and high corrosion resistance Film specifications can be selected by treatment temperature and treatment time High adhesion power to coating films Chromic-acid free product
Use after hydrophilization treatment by chemical etching Arrange reducing agents uniformly on resin surfaces Next, by activating treatment, catalysts will be adsorbed on resin by reducing reaction
Alkaline ionic catalysts solution for CFRP Better adhesion performance than acidic catalysts can be obtained Excellent in deposition performance of electroless plating
Use for electroless copper plating by horizontal conveyance system Cyanide-free, rochelle salt based product Can show high deposition performance quickly High bath stability, not cause bristers on low surface roughness substrates
Use for electroless plating, rochelle salt based Excellent in covering performance into via-holes Low residual stress Prevent blisters to low surface-roughness substrates
Use as via-filling, also applicable to through- and pattern-plating Void occurrance can be prevented very strongly Can use for via-holes from 30 to 130μm
Acid copper plating additive for via-filling and through hole plating Can realize high throwing power and great via-filling performance at the same time High ductility, bright appearances, great thermal-shock resistance come available Applicable to subtractive costruction method and M-SAP
For via-hole filling in wide current density areas Also excellent in deposition performance into through-holes Only for phosphorus content copper anodes
Use with OPC-1200 EPOETCH, sodium permanganate based solution Can use for de-smear to clean inner copper foils Make concave and convex surfaces finely on epoxy resin
Hydrogen-peroxide and sulfuric acid based Can replenish sulfuric acid, economical product Maintain etching performance from initial make-up to renewal time
Cyanide-free, EDTA based product Excellent deposition performance on silver Can omit palladium activating step Also applicable to continuous conveyance system
Can treat dyeing bathes of aluminum dyeing steps easily Can treat concentrated dyeing bathes in a short time Can reduce the cost for wastewater treatments
Can react with metallic (like Cu, Ni, Fe, Cd, Zn, Pb) ions Can cause flocculation and precipitation Can remove metallic complex compounds not containing cyanides
