COVID-19 pandemic has drastically changed our lifestyles, and remote working and online business have become mainstream. The demands for telecommunication are sharply increasing, and high-class performance is required for the devices such as 5G smartphones, computers, data centers and car electronics. Thus, the technology for IC substrates is constantly making rapid progress. To fabricate PWBs for telecommunication mobiles, build-up process has been widely used, and our copper electroplating additives have been globally adopted in the purpose.
For ultra-micro patterning in high-speed communication era, we have developed a new additive that specializes in film thickness uniformity by evolving the stacked via technology to increase the freedom of pattern designing.
For IC substrates, if copper electroplating (acid copper plating) is treated on dielectric layers and 30 μm-depth via holes are filled, the holes are sufficiently filled with 15 μm-copper thickness at the surface areas. If an additive that has high via-filling performance is used for the plating, the inside of via holes will be sufficiently filled and the top of the holes will have a dome shape. To ensure high reliability in the conductivity between layers, IC substrate manufactures generally regard the dome-shaped holes as a standard to avoid insufficient via-filling. However, the utmost plated layers have a strongly protrude (an overfilling) shape, it may damage the connection reliability in surface mounting processes. We have optimized the molecular structures of the polarization controlling agents; consequently, we have developed "TOP LUCINA HS5" that can achieve high film thickness uniformity and suppress the overfilling. This product is strongly recommended to form ultra-micro patterns for high-speed transmission, and contributes to improving the productivity and the reliability of electronic components and IC substrates.