Acid copper plating additives for horizontal roll-to-roll plating system
TOP LUCINA SVP
The continuous plating process using a roll-to-roll plating system has become the standard in acid copper plating for Flexible Printed Circuit Boards (FPCs), aimed at increasing productivity, improving the working environment, and reducing labor costs. The surface treatment of via holes has evolved from conformal plating to half-filling plating to ensure greater connection reliability. Recently, there has been a strong demand for fully filling via holes to achieve enhanced reliability and accommodate higher density requirements.
However, when using horizontal roll-to-roll equipment, traditional acid copper plating additives are unable to achieve full filling in via holes. A major reason for this limitation is the weak electrical currents that persist on the FPCs as they are conveyed between cells. These currents lead to oxidation and alteration of the copper plating films. Our company has optimized the components of the additives specifically for roll-to-roll plating equipment to control the weak currents flowing between cells, significantly enhancing via-filling performance.
Product features, specifications
TOP LUCINA SVP is the copper sulfate plating additive optimized for via-filling in horizontal roll-to-roll plating equipment used in plating for FPCs. Developed to enhance via-filling performance, this product effectively controls the weak electrical currents that flow between cells, enabling efficient and complete via filling on FPCs. Unlike traditional additives that only achieved half-filling, our product ensures full via filling.In line with its market launch, we have also established a pilot line for prototypes and are offering a variety of samples. Feel free to contact us for more information and to discuss your needs.
Acid copper plating additives for horizontal roll-to-roll plating system
TOP LUCINA SVP is the copper sulfate plating additive optimized for via-filling in horizontal roll-to-roll plating equipment used in plating for FPCs. Developed to enhance via-filling performance, this product effectively controls the weak electrical currents that flow between cells, enabling efficient and complete via filling on FPCs.