Hard anodizing on aluminum are used in many industries to enhance heat and wear resistance. They are also used in parts of semiconductor manufacturing equipment.
However, due to differences in the coefficient of thermal expansion between aluminum and hard anoodizing films, cracks can occur at high temperatures, resulting in decreased performance and quality.
Now, there is a strong demand for improved resistance to thermal cracking, especially for semiconductor manufacturing equipment operated in high-temperature environments.

Our company has developed "TOP STOUT AL-2," a crack inhibitor for oxalic acid anodizing. This new technology enables more precise designs of semiconductor manufacturing equipment, contributing to the miniaturization and enhancement of semiconductor performance.