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  • Electroless Copper Plating Process for Printed Electronics
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  • OPC COPPER NCA

    • Have high deposition performance (5 to 6μm/h)
      Great deposition selectivity
      Cyanide-free, EDTA based product
      Stabilizer can be analyzed
    • Electroless Copper Plating Solution
    • Printed Wiring Board

  • OPC COPPER HFS

    • Low internal stress, strong folding endurance, suitable for FPC boards
      Cyanide-free, rochelle salt based product
      Have great deposition selectivity
    • Electroless Copper Plating Solution
    • Printed Wiring Board

  • OPC COPPER AF-F

    • Cyanide-, formaldehyde-free, weak-alkaline product
      Excellent in pattern selectivity performance
      Excellent in initial deposition performance to low surface roughness substrates
      Prevent blisters on low surface roughness substrates
    • Electroless Copper Plating Solution
    • Printed Wiring Board

  • OIC POST DIP

    • Remove palladium residues between fine patterns
    • Post-dipping Agent
    • Printed Wiring Board

  • OIC CLEANER

    • EXcellent in permeability, weak-acid type cleaner
    • Alkaline Cleaner
    • Printed Wiring Board

  • OIC COPPER

    • Very strong deposition selectivity
      Cyanide-free, EDTA based product
    • Electroless Copper Plating Solution
    • Printed Wiring Board

  • OIC ACCERA

    • Strongly activate silver, neutral type product
    • Activator
    • Printed Wiring Board

  • ARG COPPER

    • Cyanide-free, EDTA based product
      Excellent deposition performance on silver
      Can omit palladium activating step
      Also applicable to continuous conveyance system
    • Electroless Copper Plating Solution
    • Silver Paste