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  • COA
  • Electronics
  • Printed Wiring Board
  • Electroless Ni/Au Plating Process
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  • ICP ACCERA COA

    • Reducing type catalyzing solution
      Prevent copper circuit corrosion
      Prevent voids
      Selectively activate copper circuit pattern
      Excellent in fine pattern forming performance
    • Electroless Ni-P/Au Plating Process

      Activator
    • Printed Wiring Board