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  • De-smear_Process
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  • Printed Wiring Board
  • Through Hole Plating Process
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  • OPC-1400 NEUTRALIZER VCC

    • Cleaning and conditioning epoxy surface after micro-etching
      Strong permeability into micro-holes and small areas
      Low-foaming, can use de-smear equipment by conveyance system
    • De-smear Process

      Neutralizer
    • Printed Wiring Board
  • OPC-1300 NEUTRALIZER(EDCM)

    • Use after OPC-1200 EPOETCH step
      Strongly clean etched surface of epoxy resin
      Excellent in permeability to small holes and areas
      Not containing PFOS, PFOA, endocrine disrupting chemicals
    • De-smear Process

      Neutralizer
    • Printed Wiring Board
  • OPC-1540MN

    • Use with OPC-1200 EPOETCH, sodium permanganate based solution
      Can use for de-smear to clean inner copper foils
      Make concave and convex surfaces finely on epoxy resin
    • De-smear Process

      Etchant
    • Printed Wiring Board
  • OPC-1400 NEUTRALIZER

    • Can reduce foaming
      Suitable for horizontal system of de-smear step
    • De-smear Process

      Neutralizer
    • Printed Wiring Board
  • OPC-1200 EPOETCH

    • Can use for de-smear to clean inner copper foils
      Make concave and convex surfaces finely on epoxy resin
    • De-smear Process

      Etchant
    • Printed Wiring Board
  • OPC-1080 CONDITIONER

    • Use as swelling agent, can control natural consumption
      Can clean hole inside
      Can use for de-smear strongly
    • De-smear Process

      Swelling agent
    • Printed Wiring Board
  • OPC-1050 CONDITIONER

    • Swelling agent to clean hole inside and work as de-smear
      Work for conditioning on resin surface
    • De-smear Process

      Swelling agent
    • Printed Wiring Board