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  • Electronics
  • Printed Wiring Board
  • Acid Copper Plating Additive
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  • TOP LUCINA HLS

    • High throwing power, suitable for high-aspect-ratio substrates
      Excellent via covering power for PCB with via- and through-holes
      Can use phosphorus-containing copper anodes and insoluble anodes
    • For Through-hole Plating
    • Printed Wiring Board

  • TOP LUCINA MSD

    • For copper plating using phosphorus content copper anodes
      High throwing power
      Can use for high-aspect ratio printed wiring boards
    • For Through-hole Plating
    • Printed Wiring Board

  • TOP LUCINA GL

    • For copper plating using insoluble iridium-oxide coating anodes
      High throwing power
      Can use for high-aspect ratio printed wiring boards
    • For Through-hole Plating
    • Printed Wiring Board

  • TOP LUCINA SF

    • Excellent in uniform deposition performance, deposits indicate very small stress
      Applicable to various boards from FPC to high-aspect ratio boards
    • For Through-hole Plating
    • Printed Wiring Board

  • TOP LUCINA PRS

    • Additive for periodic reverse pulse electroplating
      Can obtain bright appearances
      Strongly improve macrothrowing power
    • For Through-hole Plating
    • Printed Wiring Board

  • TOP LUCINA 81-HL

    • Multi-purpose additive, easy bath control
    • For Through-hole Plating
    • Printed Wiring Board