Electronics
Printed Wiring Board
Electroless Ni/Au Plating Process
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Neutral type electroless gold plating solution Sulfite based, cyanide free product High deposition performance on high P content electroless nickel plating films High deposition performance on palladium plating films
Electroless Ni-P/Au Plating ProcessElectroless Gold Plating Solution
Printed Wiring Board, Copper alloy, Low temperature co-fired ceramics(LTCC)
Immersion gold plating solution Use with potassium dicyanoaurate (I) Low gold concentration (0.5 g/L)
Electroless Ni-P/Au Plating ProcessElectroless Gold Plating Solution
Printed Wiring Board, Nickel
Excellent in fine pattern forming performance High selectivity to Cu patterns Less copper corrosion, a long bath life
Catalyzing Agent
Printed Wiring Board
High folding endurance Deposition rate 12μm/h (P content: 7 to 11% by weight) Prevent blackening and corrosion after stripping immersion gold plating Excellent in solder wet and solder joint performance Fine pattern and semi-bright appearance can be obtained
Electroless Ni-P/Au Plating ProcessElectroless Nickel Plating Solution
Printed Wiring Board
Reducing type catalyzing solution Prevent copper circuit corrosion Prevent voids Selectively activate copper circuit pattern Excellent in fine pattern forming performance
Electroless Ni-P/Au Plating ProcessActivator
Printed Wiring Board
High solder wettability, solder joint strength Reduce damage to base nickel films Fine and uniform deposition Deposition rate: 0.085μm/10min (at 84℃)
Electroless Ni-P/Au Plating ProcessElectroless Gold Plating Solution
Printed Wiring Board
Low-foaming, foams can be broken easily Suitable for spray machine Strongly remove dirt and resist residues Low surface tension, high permeability
Electroless Ni-P/Au Plating ProcessAlkaline Cleaner
Printed Wiring Board
Excellent in fine pattern formation performance High selectivity to copper patterns Prevent copper dissolution, a long bath life
Electroless Ni-P/Au Plating ProcessActivator
Printed Wiring Board
Acidic treatment agent to prevent deposition of electroless nickel plating into non-conductive holes in PWB Prevent electroless nickel deposition out of patterns
Electroless Ni-P/Au Plating ProcessCatalyst Masking Agent
Printed Wiring Board
Reduce damage to nickel films Fine and uniform film appearance can be obtained High solder wettability and solder joint strength Can use at a low temperature (0.06μm/10min at 80℃)
Electroless Ni-P/Au Plating ProcessElectroless Gold Plating Solution
Printed Wiring Board
Use as pretreatment for isolated circuit patterns Use after accelerating step Prevent electroless nickel deposition out of patterns Excellent in fine pattern formation performance
Electroless Ni-P/Au Plating ProcessPost-dipping Agent
Printed Wiring Board
For pretreatment to isolated circuit patterns Use after Pd acceleration to remove palladium from surfaces High selectivity only to copper electrodes Excellent in fine pattern formation performance
Electroless Ni-P/Au Plating ProcessPost-dipping Agent
Printed Wiring Board
Electroless Ni-P plating solution for isolated circuit patterns High-P content High corrosion resistance High tolerance to sulfurous acid gas
Electroless Ni-P/Au Plating ProcessElectroless Nickel Plating Solution
Printed Wiring Board
Electroless Ni-P plating solution for isolated circuit patterns High-P content, high corrosion resistance High tolerance to sulfurous acid gas
Electroless Ni-P/Au Plating ProcessElectroless Nickel Plating Solution
Printed Wiring Board
Electroless Ni-P plating solution Great corrosion resistance For fine pattern formation (P content: 11% by weight)
Electroless Ni-P/Au Plating ProcessElectroless Nickel Plating Solution
Printed Wiring Board
Electroless Ni-P plating on ceramic boards Lead-free product (P content: 7% by weight)
Electroless Ni-P/Au Plating ProcessElectroless Nickel Plating Solution
Printed Wiring Board
Electroless Ni-P plating solution High corrosion resistance, high solder wettability (P content: 9% by weight)
Electroless Ni-P/Au Plating ProcessElectroless Nickel Plating Solution
Printed Wiring Board
Electroless Ni-P plating solution Have strong folding endurance Best for FPC substrates (P content: 7% by weight)
Electroless Ni-P/Au Plating ProcessElectroless Nickel Plating Solution
Printed Wiring Board
Acidic type product, have strong cleaning power Great peameability
Electroless Ni-P/Au Plating ProcessAcidic Cleaner
Printed Wiring Board
Acidic cleaner for isolated circuit pattern Conduct micro-etching on copper surface Strongly clean copper surface for fine pattern forming
Electroless Ni-P/Au Plating ProcessAcidic Cleaner
Printed Wiring Board
Show great selectivity Work as activator
Electroless Ni-P/Au Plating ProcessActivator
Printed Wiring Board
Reducing type electroless gold plating solution Neutral-type product Cyanide-free product Excellent in wire bonding performance
Electroless Ni-P/Au Plating ProcessElectroless Gold Plating Solution
Printed Wiring Board
Electroless gold plating solution Alkaline-, reduction-type Deposition rate 5μm/h, excellent in gold-wire bonding performance
Electroless Ni-P/Au Plating ProcessElectroless Gold Plating Solution
Ceramics