Neutral type electroless gold plating solution Sulfite based, cyanide free product High deposition performance on high P content electroless nickel plating films High deposition performance on palladium plating films
High folding endurance Deposition rate 12μm/h (P content: 7 to 11% by weight) Prevent blackening and corrosion after stripping immersion gold plating Excellent in solder wet and solder joint performance Fine pattern and semi-bright appearance can be obtained
Not containing sulfur and lead compounds (Apart from sulfuric acid and sulfate ions) P content 3 to 4％ by weight, film density 8.5/cm3 Excellent in fine pattern formation performance Not make passivate films easily Prevent solder wettability decrease by oxidation Reduce solder diffusion into nickel
Deposition rate: 12μm/h P content: 7~11wt Blackening and corrosion are unlikely to occur after Au plating is peeled off Fine pattern formation performance Excellent in solder wettability and solder joint strength
Acidic treatment agent to prevent deposition of electroless nickel plating into non-conductive holes in PWB Prevent electroless nickel deposition out of patterns
Reduce damage to nickel films Fine and uniform film appearance can be obtained High solder wettability and solder joint strength Can use at a low temperature (0.06μm/10min at 80℃)
Use as pretreatment for isolated circuit patterns Use after accelerating step Prevent electroless nickel deposition out of patterns Excellent in fine pattern formation performance
For pretreatment to isolated circuit patterns Use after Pd acceleration to remove palladium from surfaces High selectivity only to copper electrodes Excellent in fine pattern formation performance
Excellent fine patterning performance, selectively activates copper circuits Low palladium concentration, little corrosion to copper, long bath life (Pd 7 mg/L). Little effect on adhesion of liqui-type d solder resists
