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  • Decorative Plating
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  • B-200 NEUTRALIZER

    • Use for PP, m-PPE (such as NORYL) resin
      Promote smooth deposition of electroless plating films
    • Surface Conditioner
    • Polypropylene(PP), Polyphenylene ether(PPE), Polyphenylene oxide(PPO), Polycarbonate(PC), Engineering plastics, General plastics, ABS, PC/ABS
  • CATALYST C-7

    • Use for PC/ABS resin
      Reduce the impact by remaining tin
      Excellent in plating selectivity to two-color molded parts
    • Catalyzer
    • PC/ABS, ABS, Nonconductor, Polycarbonate(PC), Polypropylene(PP), Polyphenylene ether(PPE), Polyphenylene oxide(PPO), Polybutylene terephthalate(PBT)
  • CATALYST C-20

    • Highly concentrated product for catalyzing
      Have strong catalyst adsorption ability
      Can decrease palladium concentration in catalyzing bathes
    • Catalyzer
    • PC/ABS, ABS, Nonconductor, Polycarbonate(PC), Polypropylene(PP), Polyphenylene ether(PPE), Polyphenylene oxide(PPO), Polybutylene terephthalate(PBT)
  • CONDITIONER 300

    • Improve catalyst adsorption ability to m-PPE (such as NORYL), PP, PBT resin
      Promote smooth deposition of electroless plating
    • Surface Conditioner
    • Polypropylene(PP), Polyphenylene ether(PPE), Polyphenylene oxide(PPO), Polycarbonate(PC), Engineering plastics, Polybutylene terephthalate(PBT), PC/ABS
  • TMP NEUTRALIZER

    • Use after etching step to reduce chromic acid remaining on resin surfaces
      Control the impact by chromic acid in catalyzing steps
      Make adsorption condition of catalysts uniform on resin surfaces
    • Neutralizer
    • ABS, PC/ABS, General plastics, Polycarbonate(PC), Polyphenylene ether(PPE), Polyphenylene oxide(PPO), Polybutylene terephthalate(PBT)
  • CRP PROCESS

    • Plating on plastic process for decorative purpose
      Make palladium-tin colloids adsorbed on plastic surface
      To operate special conducting treatment, then conduct acid copper plating
    • Direct Acid Copper Plating Process
    • ABS, PC/ABS, General plastics, Polycarbonate(PC), Polyphenylene ether(PPE), Polyphenylene oxide(PPO)
  • KAI ACNA B

    • High leveling performance, rich black brightness
      Wide control range and easy bath control
      Deposit shows high expansibility
    • Bright Nickel Plating
    • ABS, PC/ABS, General plastics, Nonconductor, General metal
  • TOP DuNC CU(G type)

    • Excellent in brightness, leveling, film properties
      High quality films come available
      Realize high leveling performance with high sulfuric-acid concentration bath
      Can use for high sulfuric-acid concentration bath
      High macrothrowing power can be realized
    • Acid Copper Plating
    • ABS, PC/ABS, Nonconductor, General metal
  • TOP DuNC CU(WF type)

    • Excellent in brightness, leveling, film properties
      High quality films come available
      Realize high leveling performance with high sulfuric-acid concentration bath
      Can use for high sulfuric-acid concentration bath
      High macro-throwing power can be realized
    • Acid Copper Plating
    • ABS, PC/ABS, Nonconductor, General metal
  • TOP LUCINA 870

    • Improve brightness and leveling performance
      Use for acid copper plating bath
      Have wide brightness range
      High leveling performance can be obtained
    • Acid Copper Plating
    • ABS, PC/ABS, Nonconductor, General metal
  • TOP LUCINA 2000

    • Uniform brightness, high leveling performance
      Excellent in film properties, have wide control range
      High-grade films can be obtained
    • Acid Copper Plating
    • ABS, PC/ABS, Nonconductor, General metal
  • TOP DuNC CU-H

    • Pit inhibitor for acid copper plating bath
      Uniform and high-corrosion resistant films can be obtained
      Semi-bright appeatance can be obtained
    • Acid Copper Plating
    • ABS, PC/ABS, Nonconductor, General metal
  • ELECTROLESS COPPER 500

    • Excellent in bath stability
      Can use for a long time by replenishing
    • Electroless Cu Plating Solution
    • ABS, PC/ABS, Nonconductor, General plastics
  • CHEMICAL NICKEL(A CONC, B CONC)

    • Use only for replenishing to increase chemical nickel concentration
      Can reduce drag-out amount just after replenishing
      Effective in terms of wastewater treatment and production costs
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS, Nonconductor, General plastics
  • CHEMICAL NICKEL RS

    • Lead-free, RoHS compliant product
      Use for substances that can't be plated easily
      Concentrated product to reduce chemical consumption
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS, Nonconductor, General plastics
  • CHEMICAL NICKEL

    • Excellent in bath stability for a long time use
      High-speed deposition, film brightness can be maintained
      Not easily damaded by scratched, prevent burnt deposition
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS, Nonconductor, General plastics
  • TMP KINKORON

    • Prevent mold and bacterium occurrence in alkaline electroless nickel plating solutions
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS, Nonconductor, General plastics
  • TOP DuNC SB-XE

    • Can obtain flexible films at wide current density areas
      Can obtain uniform appearances, prevent defects about appearances
      Can use platinum auxiliary anodes
      Excellent in electric potential stability and corrosion resistance
      Coumarin-free, formaldehyde-free
    • Semi-Bright Nickel Plating
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP DuNC CU(X type)

    • Can reduce pits
      High quality films can be easily obtained
      High-grade physical properties including malleability
      Less sludge, easy bath maintenance
      Excellent leveling ability comes available at wide range of current density
    • Acid Copper Plating
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP DuNC CU(S type)

    • ECan reduce pits
      High quality films can be easily obtained
      High-grade physical properties including malleability
      Less sludge, easy bath maintenance
      Excellent leveling ability comes available at wide range of current density
    • Acid Copper Plating
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP DuNC SB(L type)

    • Uniform semi-bright plating films with high corrosion resistance come available
      Reduce the impact on appearances by copper impurity accumulation
      Not containing coumarin, formalin
    • Semi-Bright Nickel Plating
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP DuNC SB

    • Uniform semi-bright tone, high leveling and covering power
      High-grade films can be obtained
      Reduce the impacts by additives from acid copper plating bathes
      Not containing coumarin, formalin
    • Semi-Bright Nickel Plating
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP DuNC CR

    • High macrothrowing power
      Excellent in covering power at low current density areas
      Bright appearances come available
    • Additive for Decorative Chromium Plating
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP DuNC TN

    • Use between semi-bright and bright nickel films to conduct strike nickel plating
      High corrosion resistance can be realized
    • Additive for High Corrosion Resistance
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP DuNC BN(use BN-2J)

    • Excellent in covering performance at low currect density areas
      High brightness and leveling performance can be obtained
      Excellent in covering performance in chromium plating step
    • Bright Nickel Plating
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP DuNC BN(use BN-2C)

    • High brightness, high leveling performance
      Excellent in covering power at low current density areas
      Excellent in covering power of chromium plating
    • Bright Nickel Plating
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP DuNC BN

    • Uniform brightness, high leveling performance can be obtained
      Excellent in film properties
      Excellent in covering power of chromium plating
    • Bright Nickel Plating
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP DuNC MP(MP-31)

    • Powders can be co-deposited uniformly in low current density, bottom areas of substrates
      Can reduce the consumption amount of powders
      Realize beautiful appearances and high corrosion resistance together
    • Nickel Plating Additive For Micro-porous Chromium Plating
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP DuNC ST-P

    • Additive for TOP DuNC ST-A, TOP DuNC ST-B
      Control satin color and satin effect
    • Nickel Plating with Satin Tone
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP DuNC ST-E

    • Aliminum-like, not shiny appearances can be obtained
      No need to use special equipment
    • Nickel Plating with Satin Tone
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP DuNC ST-D

    • Pearl-satin tones with strong white color can be obtained
      No need to use special equipment
    • Nickel Plating with Satin Tone
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP DuNC ST-C

    • Satin tones with high brightness can be obtained
      No need to use special equipment
    • Nickel Plating with Satin Tone
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP DuNC ST-B

    • Mat-satin appearance with low brightness can be obtained
      No need to use special equipment
    • Nickel Plating with Satin Tone
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP DuNC ST-A

    • Pearl-satin tones can be obtained
      No need to use special equipment
    • Nickel Plating with Satin Tone
    • ABS, PC/ABS, General metal, Nonconductor
  • TOP PLACON GR

    • Prevent air pocket by using with sulfuric acid
      Increase the permeability of etching solutions
      Not containing fluorine-type surfactants
    • Air-pocket Preventing Agent
    • ABS, PC/ABS, General plastics, Nonconductor
  • CHEMICAL NICKEL INHIBITOR

    • Add into electroless nickel plating solutions
      Improve plating selectivity to two-color molded parts
      Prevent deposition on plating tanks and jigs
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS, General plastics, Nonconductor
  • TOP DuNC CR-FF

    • Excellent in covering power, thickness uniformity
      Prevent anode dissolution
    • Additive for Decorative Chromium Plating
    • General metal, ABS, PC/ABS, Nonconductor
  • CONDIRIZER SP

    • Use for super engineering plastic
      Conditioning resin surfaces after etching treatment
      Promote smooth deposition of plating films
    • Surface Conditioner
    • Super engineering plastics, General plastics, Nonconductor, Engineering plastics
  • TOP DuNC POWDER FS

    • Can co-deposit insoluble ultra-fine patrticles
      Can obtain beautiful appearances regardless of co-deposition rate
      Prevent cloudy appearances, high corrosion resistance
      Can deposit at low-current density, dent areas uniformly
      Prevent blushing and burnt deposition in Cr plating steps
      Not damaging to black-color trivalent Cr plating color tones
    • Nickel Plating Additive For Micro-porous Chromium Plating
    • ABS, PC/ABS, General metal
  • ADDITIVE FOR CRP ETCHING

    • Additive for chromic acid-sulfuric acid etching bath
      Make adsorption state of catalysts uniform
      Improve deposition effect
      Strongly recommended for CRP PROCESS
    • Additive For Etchant
    • ABS, PC/ABS, General plastics
  • CRP SELECTOR NEX-S

    • Can decrease palladium concentration of catalysts
      Can use for a long time by replenishing
      Not containing formalin and strong complexing agents
      Easy wastewater treatment
    • Conductivity Inducer
    • ABS, PC/ABS, General plastics
  • CRP SELECTOR

    • Not containing formalin and strong complexing agents
      Easy wastewater treatment
      Can use for a long time by replenishing
    • Conductivity Inducer
    • ABS, PC/ABS, General plastics
  • TOP CATCH CR-200

    • Use after etching step to reduce chromic acid
      Promote catalyst adsorption on resin surface
    • Neutralizer
    • ABS, PC/ABS, General plastics
  • TOP PLACON BOW

    • Prevent air pocket by using with sulfuric acid
      Increase the permeability of etching solutions
      PFOS-, PFOA-free product
    • Air-pocket Preventing Agent
    • ABS, PC/ABS, General plastics
  • CRP CATALYST MT

    • Can reduce palladium consumption amount
      Can maintain tin (II) chloride within 50 to 60 g/L
      Uniform adsorption performance can be obtained
      High tolerance to chromic acid
      Easy bath control
    • Catalyzer
    • ABS, PC/ABS, General plastics
  • CRP CATALYST ET

    • Tin-concentration is low
      Tin accumulation can be decreased remarkably in continuous use
    • Catalyzer
    • ABS, PC/ABS, General plastics
  • CRP CATALYST 85H

    • Make adsorption performance of catalysts uniform
      High tolerance to chromic acid
      High bath stability, easy bath control
    • Catalyzer
    • ABS, PC/ABS, General plastics
  • CRP CATALYST 85

    • Excellent in adsorption performance of catalysts
      High covering performance to low current density areas
    • Catalyzer
    • ABS, PC/ABS, General plastics
  • CRP CATALYST

    • Excellent in bath stability
      High tolerance to chromic acid
    • Catalyzer
    • ABS, PC/ABS, General plastics
  • CRP CONSEALER

    • Use in water rinse steps after catalyzing
      Prevent muddiness in water caused by tin impurities
      Improve appearances of plated substrates
    • Additive for catalyst water rinsing
    • ABS, PC/ABS, General plastics
  • CONDIRIZER FR CONC

    • Use for engineering plastic (excluding ABS resin)
      Increase catalyst adsorption ability to various resin, fibers, other materials
    • Surface Conditioner
    • Engineering plastics, Fiber, Nonconductor
  • CATALYST C-10

    • Concentrated product of CATALYST C
      Excellent in bath stability
      Improve covering performance strongly
    • Catalyzer
    • PC/ABS, ABS, Nonconductor
  • ANC ACTI

    • Make copper immersion films uniformly on electroless- or strike electro-nickel films
      Promote smooth deposition of acid copper plating
      Prevent burnt deposits at contact points
    • Copper Substitution Agent
    • ABS, PC/ABS, Nonconductor
  • CATALYST PCC

    • Can add into various catalyzing solutions
      Improve the stability of catalyst bath for a long time
    • Catalyzer
    • ABS, PC/ABS, Nonconductor
  • CATALYST HICONC

    • Concentrated product for catalyzing
      Can reduce drag-out amount just after replenishing
      Best balance product for mass-production
    • Catalyzer
    • ABS, PC/ABS, Nonconductor
  • CATALYST STABILIZER

    • Increase the stability of catalysts by adding tin (II) chloride
    • Catalyzer
    • ABS, PC/ABS, Nonconductor
  • CATALYST C

    • Excellent in bath stability
      Improve covering performance strongly
      Excellent in plating selectivity to two-color molded parts
    • Catalyzer
    • ABS, PC/ABS, Nonconductor
  • A-30 CATALYST

    • Excellent in bath stability, prevent stardust
      Can use for a long time by replenishing
    • Catalyzer
    • ABS, PC/ABS, Nonconductor
  • ACCELERATOR X

    • Prevent skips in electroless plating steps
      Improve covering performance
      Long bath life by using sulfuric acid together
    • Accelerator
    • ABS, PC/ABS, Nonconductor
  • ACCELERATOR SDI-H

    • Stabilize and improve plating selectivity to two-color molded parts strongly
      Prevent deposition on jigs
    • Accelerator
    • ABS, PC/ABS, Nonconductor
  • ACCELERATOR SDI

    • Stabilize and improve plating selectivity to two-color molded parts
      Prevent deposition on jigs
    • Accelerator
    • ABS, PC/ABS, Nonconductor
  • ACCELERATOR KN

    • Long bath life, reduce nodules
    • Accelerator
    • ABS, PC/ABS, Nonconductor
  • TOP SHUT NF

    • Prevent hexavalent chromium mist scattering
      Improve work environment and work efficiency
      PFAS free
    • Mist Preventing Agent
    • General metal, ABS, PC/ABS
  • TOP NOBAC CR

    • Higher anti-bacterial, anti-virus than the films from hexavalent chromium plating bath
      Beautiful blue-black appearances by reducing yellow tones
      Hexavalent-chromium free bath
      High corrosion resistance
    • Black-color trivalent chromium plating solution
    • General metal, ABS, PC/ABS
  • TOP NOBAC ALLOY CS

    • Uniform silver white appearance
      Anti-bacterial effect continues
      Strong water resistant property, no discoloration
      Not containing cyanides (sulfuric acid based product)
      Can use as Sn-Cu alloy plating as the replacement of nickel plating
    • Copper-Tin Plating

      Antibacterial Plating
    • General metal, Nonconductor
  • TOP SCUTT IM

    • React with organic impurities in nickel plating bathes
      Decompose accumulated organic impurities
      Can extend the frequency of activated carbon treatment
    • Organic Impurities Remover
    • General metal, Nonconductor
  • NICKEL CARRIER

    • Use for bright nickel plating
      Use with common brighteners (especially with non-butyne type)
      Very excellent in brightness, leveling performance
    • Auxiliary Additive
    • General metal, Nonconductor
  • NICKEL ADAPTOR

    • Improve covering performance of bright nickel plating bathes
      Prevent bad effects by zinc-based impurities
    • Auxiliary Additive
    • General metal, Nonconductor
  • MU-2

    • Auxiliary agent for bright nickel plating
      Strongly promote the effectiveness of a primary brightener
      Prevent poor brightness at high current density areas
      Maintain the properties of electrolysis deposits
    • Auxiliary Additive
    • General metal, Nonconductor
  • ACNA NEO

    • Excellent in electric potential stability of the deposit
      Can use for high-corrosion resistant plating
      Excellent in covering performance, brightness
    • Coumarin-free Formalin-free Type
    • General metal, Nonconductor
  • ACNA NCF

    • Excellent in work environment
      Can reduce by-product accomulation
      Smells from additives can be reduced
    • Coumarin-free Formalin-free Type
    • General metal, Nonconductor
  • ACNA HSB

    • Can obtain deposit with low tension and high ductility
    • Coumarin-free Formalin-free Type
    • General metal, Nonconductor
  • ACNA SX

    • Containing formalin, only use one component
      Can reduce by-products from decomposition
      Can extend the interval of activated carbon treatment
      Easy bath control
      Best for plating on plastic
    • Coumarin-free Type
    • General metal, Nonconductor
  • ACNA SGL

    • Containing formalin
      Very excellent in leveling performance, brightness
      Can extend the interval of activated carbon treatment
      Easy bath control
    • Coumarin-free Type
    • General metal, Nonconductor
  • TOP FARBE BLB Plus

    • Beautiful blue-black tone can be obtained
      Reduce yellow tone
      Excellent in covering and deposition performance
      High corrosion resistance, high tolerance to salt damage
      (L* 58, a* 0.2, b* 1.7)
    • Black-color trivalent chromium plating solution
    • General metal, Nonconductor
  • TOP FARBE BLB

    • Blue black tone films can be obtained
      Strong black tones can be obtained without yellow tones
      (L* 63, a* 0.1, b* 1.9)
    • Black-color trivalent chromium plating solution
    • General metal, Nonconductor
  • TOP FINECHROME FMB

    • Elegant dark tones can be obtained
      Very excellent in covering and micro-throwing power
      (L* 67, a* 0.5, b* 3.5)
    • Black-color trivalent chromium plating solution
    • General metal, Nonconductor
  • TOP FINECHROME BR

    • Add into TOP FINECHROME bathes to conduct barrel plating
    • Whitish decorative trivalent chromium plating solution
    • General metal, Nonconductor
  • TOP FINECHROME

    • Light tone, white appearances can be obtained
      Similar to hexavalent chromium plating films
      Very excellent in covering and micro-throwing power
      (L* 81, a* -1.2, b* 0.6)
    • Whitish decorative trivalent chromium plating solution
    • General metal, Nonconductor
  • TOP FARBE SN-KT

    • Black nickel films can be obtained stably
      (L* 56, a* 1.3, b* 3.5)
      Use for rack and hoop plating
    • Black Color Tin-Nickel Alloy Plating Solution
    • General metal, Nonconductor
  • ACNA B-30

    • Use with ACNA B-10 and NICKEL CAREER
      Excellent in leveling performance, brightness
      Uniform, smooth deposits can be obtained at wide current density areas
    • Brightener for Blackish Tone Deposits
    • General metal, Nonconductor
  • TOP NSA-3

    • Additive for strike nickel plating
      Use between semi-bright and bright nickel films
      High corrosion resistance can be realized
    • Additive for High Corrosion Resistance
    • General metal, Nonconductor
  • SUPER NEOLIGHT

    • Excellent in brightness, leveling performance
      Show the effects immediately
    • High Leveling Brightener
    • General metal, Nonconductor
  • ACNA B-5000

    • Excellent in leveling performance, film properties
      Only use one component for replenishing
    • High Leveling Brightener
    • General metal, Nonconductor
  • ACNA B-35

    • Show high brightness, great levelling power
    • High Leveling Brightener
    • General metal, Nonconductor
  • ACNA B-250S

    • Use as bright nickel plating additive to obtain great levelling power
      Can show great brightness and levelling power at wide current density areas
    • High Leveling Brightener
    • General metal, Nonconductor
  • TOP SURFCON BR-P

    • Use after nickel plating to prevent film discoloration
      Prevent red rust, film discoloration after barrel plating
    • Post-treatment Agent
    • General metal, Nonconductor
  • TOP SCUTT CLII

    • React with metallic impurities (especially Cu, Zn) in nickel plating bath
      Immediately remove the impurities
    • Metal Impurities Remover
    • General metal, Nonconductor
  • TOP SCUTT FC

    • Make nickel, copper impurities settled in trivalent chromium plating bath
      Use with activated carbon treatment
      Removal capacity
      Nickel drops from 20mg/L to 1mg/L
      Copper drops from 1mg/L to undetectable level
    • Metal Impurities Remover
    • General metal, Nonconductor
  • ACNA B-40

    • Use as undercoats to conduct precious metal plating
      Use for plating on plastic
    • Brightener for Underlying Plating of Precious Metal
    • General metal, Nonconductor
  • TOP LEONA NL

    • Can use at wide current density areas
      Uniform, elegant, smooth films can be obtained
    • Brightener of Wide Control Range
    • General metal, Nonconductor
  • ACTIVE CARBON WET

    • Wet-type activated carbon
      Excellent in absorption power
    • Activated Carbon
    • General metal, Nonconductor
  • NICKLINER

    • Excellent in covering, leveling performances
      Uniform brightness can be obtained
      Best for substrates that are processed after plating
      Can use for rack, barrel plating
    • Barrel Plating Brightener
    • General metal, Nonconductor
  • TOP LEONA BR-PY

    • More brightness, higher leveling power at low current density areas
      (compared with TOP LEONA BR)
      Use one component, easy bath control
    • Barrel Plating Brightener
    • General metal, Nonconductor
  • TOP LEONA BR

    • Excellent in brightness, leveling performance at low current density areas
      Can obtain uniform brightness in a short time
      Consumption amount is small
    • Barrel Plating Brightener
    • General metal, Nonconductor
  • TOP SELENA

    • Brightener for nickel plating
      Use only one component
      Excellent in brightness, covering performance
    • Single Solution Type Brightener
    • General metal, Nonconductor
  • PYROTOP PC

    • Can obtain bright films
      High levelling and covering performance, great ductility can be obtained
      By controlling additive amount, can use for through hole plating to PWB
      Also can use for decorative plating
    • Copper Pyrophosphate Plating
    • General metal, Nonconductor
  • PYROTOP PB

    • Use for copper pyrophosphate plating bath (for barrel plating)
      Excellent in covering power
      Can obtain high brightness and leveling power at wide ranges
    • Copper Pyrophosphate Plating
    • General metal, Nonconductor
  • ACNA H

    • Excellent in pit preventing effect
      Consumption amount by electrolysis is small
    • Pit Preventing Agent
    • General metal, Nonconductor
  • CUSTALLOY CNF

    • Cyanide-free, acid-type copper-tin alloy plating solution
      Similar appearances with nickel plating films
      Non-magnetic, deposition rate is faster than conventional products
      Thick plating (over 10μm) is possible
      Can control alloy ratio by changing SnSO4 concentration
    • Copper-Tin Alloy Plating for Barrel
    • General metal, Nonconductor
  • CUSTALLOY

    • Use for copper-tin alloy plating
      Containing cyanides
    • Copper-Tin Alloy Plating for Barrel
    • General metal, Nonconductor
  • NISTALLOY H

    • Bright Sn-Ni alloy plating solution
      For acidic, fluoride-base bath
      Excellent in current efficiency, micro-throwing power
      Can be used by various balance bathes
      Thick plating is possible
    • Tin-Nickel Alloy Plating
    • General metal, Nonconductor
  • NISTALLOY

    • Additive for alkaline tin-nickel alloy plating solution
      For alkaline, pyrophosphoric-acid base bath
      Excellent in current efficiency, micro-throwing power
      Color tones like stainless steel can be obtained
      Easy for wastewater treatment
    • Tin-Nickel Alloy Plating
    • General metal, Nonconductor
  • SEAL NICKEL HCR-K

    • Use under micro-porous chromium plating
      Powders can be co-deposited in nickel films and improve corrosion resistance
    • Nickel Plating Additive for Micro-porous Chromium Plating
    • General metal, Nonconductor
  • TOP SHUT XP

    • Prevents the scattering of hexavalent chromium mist.
      Prevents the occurrence of uneven appearance in PC/ABS.
      PFOS-, PFOA-free.
    • Surface Conditioner
    • PC/ABS, ABS
  • CRP-LP CONDITIONER P

    • Improve catalyst adsorption ability to plastic surface
      Make palladium catalysts adsorbed uniformly
      Improve the stability of deposition performance
      Tolerant against chromic acid drag-in
    • Surface Conditioner
    • PC/ABS, ABS
  • TOP ZECROM PLUS PE2

    • Swelling agent for TOP ZECROME PLUS PROCESS
      Modify plastic surface
      Improve etching effect
    • Pre-etching Agent
    • PC/ABS, ABS
  • TOP PLACON PF

    • It prevents air pockets from occurring in molded products and provides good plating adhes
      Fluorine surfactant free
    • Air-pocket Preventing Agent
    • ABS, PC/ABS
  • CHEMICAL NI IPT-S

    • Alkaline-type electroless nickel plating solution
      Can obtain high P content film (P content: 8 to 10%)
      High corrosion resistance
      Prevent nickel film dissolution aroung contact points
      Excellent in selective deposition performance
      Prevent the deposition to jigs
      Can decrease nickel concentration, economical product
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS
  • TOP ZECROM PLUS NI(L Type)

    • Alkaline-type electroless nickel plating solution for TOP ZECROM PLUS PROCESS
      Excellent in deposition reaction, prevent no-deposition defects
      High bath stability, a long bath life
      Lead-free
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS
  • CHEMICAL NI IPT

    • Alkaline-type electroless copper plating solution
      Can obtain high P content film (P content: 8 to 10%)
      High corrosion resistance
      Prevent nickel film dissolution aroung contact points
      Excellent in selective deposition performance
      Prevent the deposition to jigs
      Can decrease nickel concentration, economical product
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS
  • CATALYST IPT

    • Can use with low palladium concentration
      Make palladium adsorbed uniformly on ABS resin, prevent skips
      Prevent palladium adsorption on jigs
    • Catalyzer
    • ABS, PC/ABS
  • NEUTRALIZER IPT

    • More strongly remove chromium than neutralization by hydrochloric acid
      Prevent deposition failures
    • Neutralizer
    • ABS, PC/ABS
  • CRP-LP SELECTOR F

    • Excellent leveling performance of acid-copper plating
      Improved continuity of conductive films
      Strong bath stability to prevent copper deposition on tanks, bath decomposition
      Can use for a long time by replenishing
      Not containing formaldehyde and strong chelating agents
      Improve working environment, easy wastewater treatment
    • Conductivity Inducer
    • ABS, PC/ABS
  • CRP-LP CATALYST F

    • Maintain colloid adsorption performance
      Long bath life with low Pd concentration
      Can maintain high adsorption power of catalysts
    • Catalyzer
    • ABS, PC/ABS
  • CRP-LP UNIDIP F

    • Make palladium catalysts adsorbed uniformly in catalyzing steps
      Control excessive catalyst adsorption on plastic
      For ABS resin, conditioning steps become unnecessary
      Control palladium catalyst amount adsorbed on jigs
    • Pre-dipping Agent
    • ABS, PC/ABS
  • CHEMICAL NICKEL AFS

    • Alkaline-type electroless nickel plating solution
      Ammonia-free, excellent in corrosion resistance
      Prevent conductivity failure caused by no deposition on jigs
      Control electroplating film dissolution
      No need to increase the thickness of electroless nickel plating films
      (High P content, P content 8 to 10%)
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS
  • CRP SELECTOR NEX-U

    • Concentrated product of CRP SELECTOR NEX-S
      Can reduce replenishing costs
    • Conductivity Inducer
    • ABS, PC/ABS
  • CRP CONDITIONER 575

    • Can use for PC/ABS and other plastic resin
      High tolerance to chromic acid drag-in
    • Surface Conditioner
    • ABS, PC/ABS
  • CRP CONDITIONER 231

    • Make adsorption condition of catalysts uniform on resin surfaces
      Can maintain and stabilize deposition performance
    • Surface Conditioner
    • ABS, PC/ABS
  • TOP PLACON BOW

    • Prevent air pocket by using sulfuric acid together
      Increase the permeability of etching solutions
      PFOS-, PFOA-free product
    • Air-pocket Preventing Agent
    • ABS, PC/ABS
  • TOP ZECROM PROCESS

    • Chromium-free etching process
      Eco-friendly process
    • Chromium-free Etching Process
    • ABS, PC/ABS
  • SURF PPE-1129 CONC

    • Use for modified PPE (such as NORYL) as pre-etching agent
    • Pre-etching Agent

      For PPE
    • Polyphenylene ether(PPE), Polyphenylene oxide(PPO)
  • TOP FINECHROME LG Plus

    • Grey-color trivalent chromium plating solution
      More black-tone than TOP FINECHROME LG
      High corrosion resiatance
      High covering performance
      Stably deposit in mass-production
    • Black-color trivalent chromium plating solution
    • General metal
  • NICLINER 10, 20

    • Use as bright nickel plating additive
      Show high brightness, levelling, covering performance
      Not causing many decomposed materials
      Easy bath control
    • Brightener of Wide Control Range
    • General metal
  • TOP SHUT XO

    • Prevent hexavalent chromium mist scattering
      Improve work environment and work efficiency
      PFOS-, PFOA-free
    • Mist Preventing Agent
    • General metal
  • NEW RARE CR

    • Designed as brightener for cyanide-base copper plating bath
      High leveling performance, shows wide brightness range
    • Copper Cyanide Plating
    • General metal
  • SENSITIZER

    • Use after hydrophilization treatment by chemical etching
      Arrange reducing agents uniformly on resin surfaces
      Next, by activating treatment, catalysts will be adsorbed on resin by reducing reaction
    • Sensitizer
    • Nonconductor
  • ACTIVATOR

    • Use after sensitizer treatment
      Precipitate metal that has catalyzing ability on non-conductive substances
    • Activator
    • Nonconductor
  • MAGICOAT PTU

    • Special thermoplastic resin coat
      Use for non-conductive substances that have weak adhesion power
    • Coating for Plating
    • Nonconductor
  • TOP ZECROM PLUS ET (ET-B CONC)

    • Eco-friendly Cr-free etchant for plastic
      Etching and catalyzing can do at the same time
    • Etchant
    • ABS
  • TOP ZECROM PLUS ET

    • Eco-friendly Cr-free etchant for plastic
      Etching and catalyzing can do at the same time
    • Etchant
    • ABS
  • TOP ZECROM PLUS R

    • Reducing agent for TOP ZECROM PLUS PROCESS
      Reduce manganase from heptavalent to divalent
    • Manganese Reduction
    • ABS
  • TOP ZECROM PLUS NI(X Type)

    • Alkaline-type electroless nickel plating solution for TOP ZECROM PLUS PROCESS
      Excellent in deposition reaction, prevent no-deposition defects
      High bath stability, a long bath life
      Lead-free
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS
  • CRP-LP CONDITIONER F

    • Improve catalyst adsorption ability to plastic surface
      Make palladium catalysts adsorbed uniformly
      Improve the stability of deposition performance
      Tolerant against chromic acid drag-in
    • Surface Conditioner
    • PC/ABS
  • TOP ZECROM PLUS PE

    • Pre-etching and swelling agent for PC/ABS resin
      Can promote etching power and catalyst adsorption
    • Pre-etching Agent
    • PC/ABS
  • CRP CONDITIONER 551M

    • Use for PC/ABS resin
      Improve adsorption condition of catalysts on resin surfaces
      Prevent deposition on and around areas covered by resists
    • Surface Conditioner
    • PC/ABS
  • SURF PC-724

    • Use for PC resin before plating
      Can obtain adhesion performance and apperance like ABS resin
    • For Polycarbonate

      Pre-etching Agent
    • Polycarbonate(PC)
  • SURF PP ACTIVE AGENT N

    • Use for PP resin in pre-etching step
    • Pre-etching Agent

      For Polypropylene
    • Polypropylene(PP)
  • PBT ETCHANT TR-F

    • Roughen surface of PBT resin
      Prevent deterioration of matrix
      Improve adhesion power
      PFOS-, PFOA-free
      Exclusive for Toray PBT resin
    • Etchant

      For PBT
    • Polybutylene terephthalate(PBT)
  • NACION PROCESS

    • Chromium-free plating process on nylon (PA6)
      No depsition on jigs
    • For Nylon
    • Polyamide(PA)
  • TN CATALYST

    • Prevent deterioration of nylon surface
      Auxiliary agent to maintain the stability of catalyzing bathes
    • Catalyzer

      For Nylon
    • Polyamide(PA)
  • TN ETCHANT MK

    • Make etching effect by hydrochloric acid uniform
      Increase adhesion performance
    • Etchant

      For Nylon
    • Polyamide(PA)
  • TN ETCHANT

    • Promote etching effect of hydrochloric acid
      Increase adhesion performance
    • Etchant

      For Nylon
    • Polyamide(PA)
  • TOP TFAC NEUTRALIZER(EDCM)

    • Remove manganese oxide from CFRP surface
      Use after TFAC EPOETCH step
      Have strong permeability into small areas
    • Neutralizer
    • Carbon fiber reinforced plastics(CFRP)
  • TOP TFAC CHEMICAL NICKEL

    • Stably fine, shiny and soft films can be obtained in continuous use
      Excellent in deposition performance
      Lead-free product
    • Alkaline Type Electroless Nickel Plating Solution

      For CFRP
    • Carbon fiber reinforced plastics(CFRP)
  • TOP TFAC PROCESS

    • Plating process for CFRP containing epoxy
      Excellent in deposition performance and adhesion power
    • For CFRP
    • Carbon fiber reinforced plastics(CFRP)
  • TOP TFAC PREDIP

    • Improve the wettability and permeability of substrates
      Stabilize alkaline ionic catalysys absorbing on surfaces
    • Pre-dipping Agent

      For CFRP
    • Carbon fiber reinforced plastics(CFRP)
  • TOP TFAC CONDITIONER

    • Remove dirt from CFRP containing epoxy
      Use after TOP TFAC CATALYST to increase palladium adsorption performance
      PFOS-, PFOA-free product
    • Surface Conditioner

      For CFRP
    • Carbon fiber reinforced plastics(CFRP)
  • TOP TFAC CATALYST

    • Alkaline ionic catalysts solution for CFRP
      Better adhesion performance than acidic catalysts can be obtained
      Excellent in deposition performance of electroless plating
    • Catalyzer

      For CFRP
    • Carbon fiber reinforced plastics(CFRP)
  • TOP TFAC EPOETCH

    • Show micro-etching effect on epoxy surface
      Improve wettability of CFRP
    • Etchant

      For CFRP
    • Carbon fiber reinforced plastics(CFRP)
  • TOP TFAC ACELERATER

    • Activate the catalysts after TOP TFAC CATALYST step
      Economical product (because boric acid can be added separately)
    • Accelerator

      For CFRP
    • Carbon fiber reinforced plastics(CFRP)
  • TOP TFAC SW

    • Show swelling effect for CFRP containing epoxy
      Improve etching effect of TOP TFAC EPOETCH
    • Swelling Agent

      For CFRP
    • Carbon fiber reinforced plastics(CFRP)
  • TOP NDN NICKEL B

    • High leveling performance, excellent brightness
      High deposition performance at low current density areas
    • High Leveling Brightener
    • Neodymium alloy