Use after etching step to reduce chromic acid remaining on resin surfaces Control the impact by chromic acid in catalyzing steps Make adsorption condition of catalysts uniform on resin surfaces
Plating on plastic process for decorative purpose Make palladium-tin colloids adsorbed on plastic surface To operate special conducting treatment, then conduct acid copper plating
Direct Acid Copper Plating Process
ABS, PC/ABS, General plastics, Polycarbonate(PC), Polyphenylene ether(PPE), Polyphenylene oxide(PPO)
Excellent in brightness, leveling, film properties High quality films come available Realize high leveling performance with high sulfuric-acid concentration bath Can use for high sulfuric-acid concentration bath High macrothrowing power can be realized
Excellent in brightness, leveling, film properties High quality films come available Realize high leveling performance with high sulfuric-acid concentration bath Can use for high sulfuric-acid concentration bath High macro-throwing power can be realized
Use only for replenishing to increase chemical nickel concentration Can reduce drag-out amount just after replenishing Effective in terms of wastewater treatment and production costs
Excellent in bath stability for a long time use High-speed deposition, film brightness can be maintained Not easily damaded by scratched, prevent burnt deposition
Can obtain flexible films at wide current density areas Can obtain uniform appearances, prevent defects about appearances Can use platinum auxiliary anodes Excellent in electric potential stability and corrosion resistance Coumarin-free, formaldehyde-free
Can reduce pits High quality films can be easily obtained High-grade physical properties including malleability Less sludge, easy bath maintenance Excellent leveling ability comes available at wide range of current density
ECan reduce pits High quality films can be easily obtained High-grade physical properties including malleability Less sludge, easy bath maintenance Excellent leveling ability comes available at wide range of current density
Uniform semi-bright plating films with high corrosion resistance come available Reduce the impact on appearances by copper impurity accumulation Not containing coumarin, formalin
Uniform semi-bright tone, high leveling and covering power High-grade films can be obtained Reduce the impacts by additives from acid copper plating bathes Not containing coumarin, formalin
Excellent in covering performance at low currect density areas High brightness and leveling performance can be obtained Excellent in covering performance in chromium plating step
Powders can be co-deposited uniformly in low current density, bottom areas of substrates Can reduce the consumption amount of powders Realize beautiful appearances and high corrosion resistance together
Nickel Plating Additive For Micro-porous Chromium Plating
Can co-deposit insoluble ultra-fine patrticles Can obtain beautiful appearances regardless of co-deposition rate Prevent cloudy appearances, high corrosion resistance Can deposit at low-current density, dent areas uniformly Prevent blushing and burnt deposition in Cr plating steps Not damaging to black-color trivalent Cr plating color tones
Nickel Plating Additive For Micro-porous Chromium Plating
Additive for chromic acid-sulfuric acid etching bath Make adsorption state of catalysts uniform Improve deposition effect Strongly recommended for CRP PROCESS
Can decrease palladium concentration of catalysts Can use for a long time by replenishing Not containing formalin and strong complexing agents Easy wastewater treatment
Can reduce palladium consumption amount Can maintain tin (II) chloride within 50 to 60 g/L Uniform adsorption performance can be obtained High tolerance to chromic acid Easy bath control
Make copper immersion films uniformly on electroless- or strike electro-nickel films Promote smooth deposition of acid copper plating Prevent burnt deposits at contact points
Higher anti-bacterial, anti-virus than the films from hexavalent chromium plating bath Beautiful blue-black appearances by reducing yellow tones Hexavalent-chromium free bath High corrosion resistance
Uniform silver white appearance Anti-bacterial effect continues Strong water resistant property, no discoloration Not containing cyanides (sulfuric acid based product) Can use as Sn-Cu alloy plating as the replacement of nickel plating
Auxiliary agent for bright nickel plating Strongly promote the effectiveness of a primary brightener Prevent poor brightness at high current density areas Maintain the properties of electrolysis deposits
Containing formalin, only use one component Can reduce by-products from decomposition Can extend the interval of activated carbon treatment Easy bath control Best for plating on plastic
Beautiful blue-black tone can be obtained Reduce yellow tone Excellent in covering and deposition performance High corrosion resistance, high tolerance to salt damage (L* 58, a* 0.2, b* 1.7)
Light tone, white appearances can be obtained Similar to hexavalent chromium plating films Very excellent in covering and micro-throwing power (L* 81, a* -1.2, b* 0.6)
Use with ACNA B-10 and NICKEL CAREER Excellent in leveling performance, brightness Uniform, smooth deposits can be obtained at wide current density areas
Make nickel, copper impurities settled in trivalent chromium plating bath Use with activated carbon treatment Removal capacity Nickel drops from 20mg/L to 1mg/L Copper drops from 1mg/L to undetectable level
Excellent in covering, leveling performances Uniform brightness can be obtained Best for substrates that are processed after plating Can use for rack, barrel plating
Can obtain bright films High levelling and covering performance, great ductility can be obtained By controlling additive amount, can use for through hole plating to PWB Also can use for decorative plating
Use for copper pyrophosphate plating bath (for barrel plating) Excellent in covering power Can obtain high brightness and leveling power at wide ranges
Cyanide-free, acid-type copper-tin alloy plating solution Similar appearances with nickel plating films Non-magnetic, deposition rate is faster than conventional products Thick plating (over 10μm) is possible Can control alloy ratio by changing Tin () sulfate concentration
Bright Sn-Ni alloy plating solution For acidic, fluoride-base bath Excellent in current efficiency, micro-throwing power Can be used by various balance bathes Thick plating is possible
Additive for alkaline tin-nickel alloy plating solution For alkaline, pyrophosphoric-acid base bath Excellent in current efficiency, micro-throwing power Color tones like stainless steel can be obtained Easy for wastewater treatment
Improve catalyst adsorption ability to plastic surface Make palladium catalysts adsorbed uniformly Improve the stability of deposition performance Tolerant against chromic acid drag-in
Alkaline-type electroless nickel plating solution Can obtain high P content film (P content: 8 to 10%) High corrosion resistance Prevent nickel film dissolution aroung contact points Excellent in selective deposition performance Prevent the deposition to jigs Can decrease nickel concentration, economical product
Alkaline-type electroless nickel plating solution for TOP ZECROM PLUS PROCESS Excellent in deposition reaction, prevent no-deposition defects High bath stability, a long bath life Lead-free
Alkaline-type electroless copper plating solution Can obtain high P content film (P content: 8 to 10%) High corrosion resistance Prevent nickel film dissolution aroung contact points Excellent in selective deposition performance Prevent the deposition to jigs Can decrease nickel concentration, economical product
Excellent leveling performance of acid-copper plating Improved continuity of conductive films Strong bath stability to prevent copper deposition on tanks, bath decomposition Can use for a long time by replenishing Not containing formaldehyde and strong chelating agents Improve working environment, easy wastewater treatment
Make palladium catalysts adsorbed uniformly in catalyzing steps Control excessive catalyst adsorption on plastic For ABS resin, conditioning steps become unnecessary Control palladium catalyst amount adsorbed on jigs
Alkaline-type electroless nickel plating solution Ammonia-free, excellent in corrosion resistance Prevent conductivity failure caused by no deposition on jigs Control electroplating film dissolution No need to increase the thickness of electroless nickel plating films (High P content, P content 8 to 10%)
Grey-color trivalent chromium plating solution More black-tone than TOP FINECHROME LG High corrosion resiatance High covering performance Stably deposit in mass-production
Use after hydrophilization treatment by chemical etching Arrange reducing agents uniformly on resin surfaces Next, by activating treatment, catalysts will be adsorbed on resin by reducing reaction
Alkaline-type electroless nickel plating solution for TOP ZECROM PLUS PROCESS Excellent in deposition reaction, prevent no-deposition defects High bath stability, a long bath life Lead-free
Improve catalyst adsorption ability to plastic surface Make palladium catalysts adsorbed uniformly Improve the stability of deposition performance Tolerant against chromic acid drag-in
Alkaline ionic catalysts solution for CFRP Better adhesion performance than acidic catalysts can be obtained Excellent in deposition performance of electroless plating
