
Flexible circuit boards—offering exceptional bendability and fold resistance—are critical components in today’s thin, lightweight, and vibration-resistant electronic devices, from smartphones and wearables to automotive electronics. As usage expands, nickel/gold plating films must meet ever-higher flexing demands.
At the same time, global sustainability initiatives like the UN’s Sustainable Development Goals (SDGs) have driven renewed interest in metal recycling. Yet nickel recovery and reuse technologies remain underdeveloped, underscoring the urgent need for innovative, practical solutions.
ICP NICORON FPF (RS) answers this call. This electroless nickel-plating solution for isolated circuit boards uses nickel sulfate reclaimed from end-of-life lithium-ion battery cathodes, delivering outstanding bendability while dramatically reducing environmental impact.
The result is an ideal balance of reliable electrical performance and a smaller ecological footprint—making ICP NICORON FPF (RS) the sustainable choice for next-generation flexible electronics.
1. Electroless Ni–P plating solution using recycled nickel salts
2. Exceptional folding (bending) resistance
3. Deposition rate: 10 μm/h; phosphorus content: 6–8 wt%
4. Minimize blackening and corrosion after stripping gold plating films
5. Outstanding fine-pattern plating performance
6. Superior solder wettability and joint strength
7. Produce a dense, uniform, semi-gloss plating films