
Nowadays, PCBs (printed circuit boards) used in communication devices—such as smartphones and tablets—and in automotive electronics must deliver superior reliability, expanded functionality, and enhanced performance.
At the same time, global sustainability initiatives like the UN’s Sustainable Development Goals (SDGs) have driven renewed interest in metal recycling. Yet nickel recovery and reuse technologies remain underdeveloped, underscoring the urgent need for innovative, practical solutions.
ICP NICORON GME (RS) answers this call. This electroless nickel-plating solution for rigid PCBs uses nickel sulfate reclaimed from end-of-life lithium-ion battery cathodes, delivering outstanding bendability while dramatically reducing environmental impact.
The result is an ideal balance of reliable electrical performance and a smaller ecological footprint—making ICP NICORON GME (RS) the sustainable choice for next-generation rigid boards.
1. Electroless Ni–P plating solution using recycled nickel salts
2. Electroless nickel plating solution for rigid PCBs
3. Minimize blackening and corrosion after stripping gold plating films
4. Superior solder wettability and joint strength
5. Minimize the attack and the penetration of resist films
6. Outstanding fine-pattern plating performance
7. Produce a dense, uniform, semi-gloss plating films