Power semiconductors, also known as power devices, are used to control and convert electrical power. They are widely used in power generation, bullet trains, trains, automobiles, and everyday household appliances like smartphones, computers, and refrigerators. Power semiconductors has been made with silicon (Si), which has a stable structure. However, power semiconductors made with silicon carbide (SiC) are now gaining attention due to their excellent heat resistance and long-term reliability. Additionally, research is progressing on sintering bonding using metal nanoparticles, such as copper and silver, as an alternative to solder bonding to achieve higher thermal conductivity and heat resistance. OKUNO offers a wide range of surface treatment chemicals for power semiconductor industries. We will introduce our product lineup that supports the manufacturing processes for Aluminum Active Metal Brazed (AMB) dielectric ceramic substrates.
TOTAL PROCESS:
Electroless plating process for Direct Copper Bonding (DCB) dielectric ceramic substrates
TOTAL PROCESS:
Electroless plating process applicable to UBM formation for aluminum electrodes on wafers
Remove dirt from aluminum surface, improve surface wettability.
Etch the surface of aluminum sputtering films to remove oxidized films to improve the adhesion with electroless nickel plating films.
Remove smut and insoluble matters such as copper, zinc, silicon contained in aluminum alloys.
Form a dense zincate film on aluminum electrode surfaces.
Dissolve the first zincate film.
Make a uniform oxide film that conforms to the surface shape, to promote dense film formation in the second zincate process.
Form an even denser film m on the aluminum electrode surface than the one produced in the first zincate step.
Immerse into an electroless nickel plating solution containing nickel salts, reducing agents, and chelating agents. Nickel deposits by immersion reaction with zinc, and plating progresses through a self-catalytic reaction, forming a dense nickel film.
Obtain a palladium plating film with excellent heat resistance and barrier properties.
Obtain a gold plating film with excellent solder wettability, solder joint performance, gold wire bonding performance.
