Can use for the substrates that are weak to allkali Easily remove foams after cleaning Can use at a lower temperature to save energy cost Not containing PFAS, endocrine disrupting chemicals
The OPC FLET-S process is an electroless copper plating process suitable for the subtractive method, MSAP. Excellent for uniform deposition on the material surface, via holes, and through holes, reducing circuit width narrowing during flash etching, and suppressing precipitation on copper, resulting in continuous crystal formation between inner layer copper and upper layer plating copper This is the optimum process for improving reliability by realizing reliability.
Cleaning and conditioning epoxy surface after micro-etching Strong permeability into micro-holes and small areas Low-foaming, can use de-smear equipment by conveyance system
Use after OPC-1200 EPOETCH step Strongly clean etched surface of epoxy resin Excellent in permeability to small holes and areas Not containing PFOS, PFOA, endocrine disrupting chemicals
Promote catalyst adsorption evenly High deposition performance to substrates that can't be plated easily Weak alkaline based, can use for substrates that can't be treated by alkali Excellent permeability into small-diameter blind via holes High cleaning performance to copper foils
Electroless copper plating solution, rochelle salt based Can obtain smooth and bright appearances Suitable for rolled copper foils to prevent nodules after acid copper plating
Use with OPC-1200 EPOETCH, sodium permanganate based solution Can use for de-smear to clean inner copper foils Make concave and convex surfaces finely on epoxy resin
Hydrogen-peroxide and sulfuric acid based Can replenish sulfuric acid, economical product Maintain etching performance from initial make-up to renewal time
