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  • Printed Wiring Board
  • Plating Process For FCCL
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  • TOP LECS PREDIP

    • Stabilize catalyst adsorption in alkaline-catalyzing step
      Give wettability to LCP
      Improve penetrating performance into small-diameter holes
    • Pre-dipping Agent
    • Liquid crystal polymer(LCP), Printed Wiring Board

  • TOP LECS COPPER

    • High deposition performance, great adheison to LCP
      Flat and smooth films come available, prevent blisters and peel-off
      High bath stability, a long bath life
    • Electroless Copper Plating Solution
    • Liquid crystal polymer(LCP), Printed Wiring Board

  • TOP LECS ACCELERATOR

    • High acceleration performance to catalysts
      Boric acid is separately added for cost reduction
    • Accelerator
    • Liquid crystal polymer(LCP), Printed Wiring Board

  • TOP LECS CATALYST

    • Uniform palladium adsorption power to LCP
      Alkaline-product, prevent haloing more strongly than acidic-type
      High penetrating performance to small-diameter holes
    • Catalyzing Agent
    • Liquid crystal polymer(LCP), Printed Wiring Board

  • TOP LECS PREDIP M

    • Stabilize catalyst adsorption in alkaline-catalyzing step
      Give wettability to LCP
      Improve penetrating performance into small-diameter holes
    • Pre-dipping Agent
    • Liquid crystal polymer(LCP), Printed Wiring Board

  • TOP LECS CONDITIONER

    • Strongly clean resin and copper surfaces
      High penertating power to small-diameter holes
      Promote catalyst adsorption on hole wall
    • Conditioner
    • Liquid crystal polymer(LCP), Printed Wiring Board

  • TOP LECS PRECONDITION

    • Give wattability to LCP surface
      Improve adhesion between copper and LCP
    • Surface Conditioner
    • Liquid crystal polymer(LCP), Printed Wiring Board

  • TOP SAPINA PREDIP

    • Promote catalyst adsorption in alkaline catalyst step
    • Pre-dipping Agent
    • Printed Wiring Board, Polyimide(PI)

  • TOP SAPINA PRECONDITION

    • Modify polyimide film
      Improve surface wettability and adhesion performance
    • Surface Conditioner
    • Printed Wiring Board, Polyimide(PI)

  • TOP SAPINA NICKEL

    • Electroless nickel plating films with low P content, low film stress can be obtained
      High bath stability
      Economical product
    • Alkaline Type Electroless Nickel Plating Solution
    • Printed Wiring Board, Polyimide(PI)

  • TOP SAPINA STRIKE

    • Use to seed layer made by electroless nickel plating
      Excellent covering performance
      Non-bright appearance films can be obtained
    • Strike Plating
    • Printed Wiring Board, Polyimide(PI)

  • TOP SAPINA CONDITIONER

    • Alkaline type conditioning for polyimide
      Remove dirt from surface
      Increase permeability into holes
    • Conditioner
    • Printed Wiring Board, Polyimide(PI)

  • TOP SAPINA CATALYST

    • Alkaline catalyst type catalyzing solution
      Can decrease palladium concentration from conventional level
      Excellent in bath stability
    • Catalyzing Agent
    • Printed Wiring Board, Polyimide(PI)

  • TOP SAPINA ACTI

    • Increase adhesion power of the interface between nickel seed layers and acid copper plating
      Increase covering performance in acid copper plating step
    • Activator for Nickel
    • Printed Wiring Board, Polyimide(PI)

  • TOP SAPINA ACCELERATOR

    • Accelerator, alkaline-ion catalyst type
      Accelerate catalysts
    • Accelerator
    • Printed Wiring Board, Polyimide(PI)