High covering performance, uniform deposition by small thickness Deposition rate 0.15μm/2min Excellent in fine patterning formation performance High solder joint, high gold wire bonding performance
Auto-catalytic type electroless palladium plating solution Palladium purity over 99％ (P content below 1%) is possible Great bath stability, tolerant against dragged-in impurities High solder-joint and heat-resistant gold wire bonding performance can be obtained after immersion gold plating on PALLATOP LP film Neutral bath, reduce damage to substrates Cyanide-free products
High solder wettability, solder joint strength and gold wire bonding performance Best product for electroless Ni-P/Pd/Au process Stable deposition performance, can obtain uniform deposits on palladium films High deposition performance (0.1μm/25min, on 0.1μm of palladium film) Prevent base film corrosion
