PLOPX

• An electroless copper plating process that achieves high adhesion on glass, which is a candidate for interposer substrate for semiconductor packages
  The Liquid Phase Deposition (LPD) method is used to form an adhesion layer of metal oxide
  Ensures high adhesion between electroless copper plating and glass substrates, and can be used for high-speed communication systems in 5G and 6G era
• Plating process for glass