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  • Decorative Plating
  • Pretreatment Agent for Plastics
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  • B-200 NEUTRALIZER

    • Use for PP, m-PPE (such as NORYL) resin
      Promote smooth deposition of electroless plating films
    • Surface Conditioner
    • Polypropylene(PP), Polyphenylene ether(PPE), Polyphenylene oxide(PPO), Polycarbonate(PC), Engineering plastics, General plastics, ABS, PC/ABS
  • CATALYST C-7

    • Use for PC/ABS resin
      Reduce the impact by remaining tin
      Excellent in plating selectivity to two-color molded parts
    • Catalyzer
    • PC/ABS, ABS, Nonconductor, Polycarbonate(PC), Polypropylene(PP), Polyphenylene ether(PPE), Polyphenylene oxide(PPO), Polybutylene terephthalate(PBT)
  • CATALYST C-20

    • Highly concentrated product for catalyzing
      Have strong catalyst adsorption ability
      Can decrease palladium concentration in catalyzing bathes
    • Catalyzer
    • PC/ABS, ABS, Nonconductor, Polycarbonate(PC), Polypropylene(PP), Polyphenylene ether(PPE), Polyphenylene oxide(PPO), Polybutylene terephthalate(PBT)
  • CONDITIONER 300

    • Improve catalyst adsorption ability to m-PPE (such as NORYL), PP, PBT resin
      Promote smooth deposition of electroless plating
    • Surface Conditioner
    • Polypropylene(PP), Polyphenylene ether(PPE), Polyphenylene oxide(PPO), Polycarbonate(PC), Engineering plastics, Polybutylene terephthalate(PBT), PC/ABS
  • TMP NEUTRALIZER

    • Use after etching step to reduce chromic acid remaining on resin surfaces
      Control the impact by chromic acid in catalyzing steps
      Make adsorption condition of catalysts uniform on resin surfaces
    • Neutralizer
    • ABS, PC/ABS, General plastics, Polycarbonate(PC), Polyphenylene ether(PPE), Polyphenylene oxide(PPO), Polybutylene terephthalate(PBT)
  • CRP PROCESS

    • Plating on plastic process for decorative purpose
      Make palladium-tin colloids adsorbed on plastic surface
      To operate special conducting treatment, then conduct acid copper plating
    • Direct Acid Copper Plating Process
    • ABS, PC/ABS, General plastics, Polycarbonate(PC), Polyphenylene ether(PPE), Polyphenylene oxide(PPO)
  • ELECTROLESS COPPER 500

    • Excellent in bath stability
      Can use for a long time by replenishing
    • Electroless Cu Plating Solution
    • ABS, PC/ABS, Nonconductor, General plastics
  • CHEMICAL NICKEL(A CONC, B CONC)

    • Use only for replenishing to increase chemical nickel concentration
      Can reduce drag-out amount just after replenishing
      Effective in terms of wastewater treatment and production costs
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS, Nonconductor, General plastics
  • CHEMICAL NICKEL RS

    • Lead-free, RoHS compliant product
      Use for substances that can't be plated easily
      Concentrated product to reduce chemical consumption
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS, Nonconductor, General plastics
  • CHEMICAL NICKEL

    • Excellent in bath stability for a long time use
      High-speed deposition, film brightness can be maintained
      Not easily damaded by scratched, prevent burnt deposition
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS, Nonconductor, General plastics
  • TMP KINKORON

    • Prevent mold and bacterium occurrence in alkaline electroless nickel plating solutions
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS, Nonconductor, General plastics
  • TOP PLACON GR

    • Prevent air pocket by using with sulfuric acid
      Increase the permeability of etching solutions
      Not containing fluorine-type surfactants
    • Air-pocket Preventing Agent
    • ABS, PC/ABS, General plastics, Nonconductor
  • CHEMICAL NICKEL INHIBITOR

    • Add into electroless nickel plating solutions
      Improve plating selectivity to two-color molded parts
      Prevent deposition on plating tanks and jigs
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS, General plastics, Nonconductor
  • CONDIRIZER SP

    • Use for super engineering plastic
      Conditioning resin surfaces after etching treatment
      Promote smooth deposition of plating films
    • Surface Conditioner
    • Super engineering plastics, General plastics, Nonconductor, Engineering plastics
  • ADDITIVE FOR CRP ETCHING

    • Additive for chromic acid-sulfuric acid etching bath
      Make adsorption state of catalysts uniform
      Improve deposition effect
      Strongly recommended for CRP PROCESS
    • Additive For Etchant
    • ABS, PC/ABS, General plastics
  • CRP SELECTOR NEX-S

    • Can decrease palladium concentration of catalysts
      Can use for a long time by replenishing
      Not containing formalin and strong complexing agents
      Easy wastewater treatment
    • Conductivity Inducer
    • ABS, PC/ABS, General plastics
  • CRP SELECTOR

    • Not containing formalin and strong complexing agents
      Easy wastewater treatment
      Can use for a long time by replenishing
    • Conductivity Inducer
    • ABS, PC/ABS, General plastics
  • TOP CATCH CR-200

    • Use after etching step to reduce chromic acid
      Promote catalyst adsorption on resin surface
    • Neutralizer
    • ABS, PC/ABS, General plastics
  • TOP PLACON BOW

    • Prevent air pocket by using with sulfuric acid
      Increase the permeability of etching solutions
      PFOS-, PFOA-free product
    • Air-pocket Preventing Agent
    • ABS, PC/ABS, General plastics
  • CRP CATALYST MT

    • Can reduce palladium consumption amount
      Can maintain tin (II) chloride within 50 to 60 g/L
      Uniform adsorption performance can be obtained
      High tolerance to chromic acid
      Easy bath control
    • Catalyzer
    • ABS, PC/ABS, General plastics
  • CRP CATALYST ET

    • Tin-concentration is low
      Tin accumulation can be decreased remarkably in continuous use
    • Catalyzer
    • ABS, PC/ABS, General plastics
  • CRP CATALYST 85H

    • Make adsorption performance of catalysts uniform
      High tolerance to chromic acid
      High bath stability, easy bath control
    • Catalyzer
    • ABS, PC/ABS, General plastics
  • CRP CATALYST 85

    • Excellent in adsorption performance of catalysts
      High covering performance to low current density areas
    • Catalyzer
    • ABS, PC/ABS, General plastics
  • CRP CATALYST

    • Excellent in bath stability
      High tolerance to chromic acid
    • Catalyzer
    • ABS, PC/ABS, General plastics
  • CRP CONSEALER

    • Use in water rinse steps after catalyzing
      Prevent muddiness in water caused by tin impurities
      Improve appearances of plated substrates
    • Additive for catalyst water rinsing
    • ABS, PC/ABS, General plastics
  • CONDIRIZER FR CONC

    • Use for engineering plastic (excluding ABS resin)
      Increase catalyst adsorption ability to various resin, fibers, other materials
    • Surface Conditioner
    • Engineering plastics, Fiber, Nonconductor
  • CATALYST C-10

    • Concentrated product of CATALYST C
      Excellent in bath stability
      Improve covering performance strongly
    • Catalyzer
    • PC/ABS, ABS, Nonconductor
  • ANC ACTI

    • Make copper immersion films uniformly on electroless- or strike electro-nickel films
      Promote smooth deposition of acid copper plating
      Prevent burnt deposits at contact points
    • Copper Substitution Agent
    • ABS, PC/ABS, Nonconductor
  • CATALYST PCC

    • Can add into various catalyzing solutions
      Improve the stability of catalyst bath for a long time
    • Catalyzer
    • ABS, PC/ABS, Nonconductor
  • CATALYST HICONC

    • Concentrated product for catalyzing
      Can reduce drag-out amount just after replenishing
      Best balance product for mass-production
    • Catalyzer
    • ABS, PC/ABS, Nonconductor
  • CATALYST STABILIZER

    • Increase the stability of catalysts by adding tin (II) chloride
    • Catalyzer
    • ABS, PC/ABS, Nonconductor
  • CATALYST C

    • Excellent in bath stability
      Improve covering performance strongly
      Excellent in plating selectivity to two-color molded parts
    • Catalyzer
    • ABS, PC/ABS, Nonconductor
  • A-30 CATALYST

    • Excellent in bath stability, prevent stardust
      Can use for a long time by replenishing
    • Catalyzer
    • ABS, PC/ABS, Nonconductor
  • ACCELERATOR X

    • Prevent skips in electroless plating steps
      Improve covering performance
      Long bath life by using sulfuric acid together
    • Accelerator
    • ABS, PC/ABS, Nonconductor
  • ACCELERATOR SDI-H

    • Stabilize and improve plating selectivity to two-color molded parts strongly
      Prevent deposition on jigs
    • Accelerator
    • ABS, PC/ABS, Nonconductor
  • ACCELERATOR SDI

    • Stabilize and improve plating selectivity to two-color molded parts
      Prevent deposition on jigs
    • Accelerator
    • ABS, PC/ABS, Nonconductor
  • ACCELERATOR KN

    • Long bath life, reduce nodules
    • Accelerator
    • ABS, PC/ABS, Nonconductor
  • TOP SHUT XP

    • Prevents the scattering of hexavalent chromium mist.
      Prevents the occurrence of uneven appearance in PC/ABS.
      PFOS-, PFOA-free.
    • Surface Conditioner
    • PC/ABS, ABS
  • CRP-LP CONDITIONER P

    • Improve catalyst adsorption ability to plastic surface
      Make palladium catalysts adsorbed uniformly
      Improve the stability of deposition performance
      Tolerant against chromic acid drag-in
    • Surface Conditioner
    • PC/ABS, ABS
  • TOP ZECROM PLUS PE2

    • Swelling agent for TOP ZECROME PLUS PROCESS
      Modify plastic surface
      Improve etching effect
    • Pre-etching Agent
    • PC/ABS, ABS
  • TOP PLACON PF

    • It prevents air pockets from occurring in molded products and provides good plating adhes
      Fluorine surfactant free
    • Air-pocket Preventing Agent
    • ABS, PC/ABS
  • CHEMICAL NI IPT-S

    • Alkaline-type electroless nickel plating solution
      Can obtain high P content film (P content: 8 to 10%)
      High corrosion resistance
      Prevent nickel film dissolution aroung contact points
      Excellent in selective deposition performance
      Prevent the deposition to jigs
      Can decrease nickel concentration, economical product
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS
  • TOP ZECROM PLUS NI(L Type)

    • Alkaline-type electroless nickel plating solution for TOP ZECROM PLUS PROCESS
      Excellent in deposition reaction, prevent no-deposition defects
      High bath stability, a long bath life
      Lead-free
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS
  • CHEMICAL NI IPT

    • Alkaline-type electroless copper plating solution
      Can obtain high P content film (P content: 8 to 10%)
      High corrosion resistance
      Prevent nickel film dissolution aroung contact points
      Excellent in selective deposition performance
      Prevent the deposition to jigs
      Can decrease nickel concentration, economical product
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS
  • CATALYST IPT

    • Can use with low palladium concentration
      Make palladium adsorbed uniformly on ABS resin, prevent skips
      Prevent palladium adsorption on jigs
    • Catalyzer
    • ABS, PC/ABS
  • NEUTRALIZER IPT

    • More strongly remove chromium than neutralization by hydrochloric acid
      Prevent deposition failures
    • Neutralizer
    • ABS, PC/ABS
  • CRP-LP SELECTOR F

    • Excellent leveling performance of acid-copper plating
      Improved continuity of conductive films
      Strong bath stability to prevent copper deposition on tanks, bath decomposition
      Can use for a long time by replenishing
      Not containing formaldehyde and strong chelating agents
      Improve working environment, easy wastewater treatment
    • Conductivity Inducer
    • ABS, PC/ABS
  • CRP-LP CATALYST F

    • Maintain colloid adsorption performance
      Long bath life with low Pd concentration
      Can maintain high adsorption power of catalysts
    • Catalyzer
    • ABS, PC/ABS
  • CRP-LP UNIDIP F

    • Make palladium catalysts adsorbed uniformly in catalyzing steps
      Control excessive catalyst adsorption on plastic
      For ABS resin, conditioning steps become unnecessary
      Control palladium catalyst amount adsorbed on jigs
    • Pre-dipping Agent
    • ABS, PC/ABS
  • CHEMICAL NICKEL AFS

    • Alkaline-type electroless nickel plating solution
      Ammonia-free, excellent in corrosion resistance
      Prevent conductivity failure caused by no deposition on jigs
      Control electroplating film dissolution
      No need to increase the thickness of electroless nickel plating films
      (High P content, P content 8 to 10%)
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS
  • CRP SELECTOR NEX-U

    • Concentrated product of CRP SELECTOR NEX-S
      Can reduce replenishing costs
    • Conductivity Inducer
    • ABS, PC/ABS
  • CRP CONDITIONER 575

    • Can use for PC/ABS and other plastic resin
      High tolerance to chromic acid drag-in
    • Surface Conditioner
    • ABS, PC/ABS
  • CRP CONDITIONER 231

    • Make adsorption condition of catalysts uniform on resin surfaces
      Can maintain and stabilize deposition performance
    • Surface Conditioner
    • ABS, PC/ABS
  • TOP PLACON BOW

    • Prevent air pocket by using sulfuric acid together
      Increase the permeability of etching solutions
      PFOS-, PFOA-free product
    • Air-pocket Preventing Agent
    • ABS, PC/ABS
  • TOP ZECROM PROCESS

    • Chromium-free etching process
      Eco-friendly process
    • Chromium-free Etching Process
    • ABS, PC/ABS
  • SURF PPE-1129 CONC

    • Use for modified PPE (such as NORYL) as pre-etching agent
    • Pre-etching Agent

      For PPE
    • Polyphenylene ether(PPE), Polyphenylene oxide(PPO)
  • SENSITIZER

    • Use after hydrophilization treatment by chemical etching
      Arrange reducing agents uniformly on resin surfaces
      Next, by activating treatment, catalysts will be adsorbed on resin by reducing reaction
    • Sensitizer
    • Nonconductor
  • ACTIVATOR

    • Use after sensitizer treatment
      Precipitate metal that has catalyzing ability on non-conductive substances
    • Activator
    • Nonconductor
  • MAGICOAT PTU

    • Special thermoplastic resin coat
      Use for non-conductive substances that have weak adhesion power
    • Coating for Plating
    • Nonconductor
  • TOP ZECROM PLUS ET (ET-B CONC)

    • Eco-friendly Cr-free etchant for plastic
      Etching and catalyzing can do at the same time
    • Etchant
    • ABS
  • TOP ZECROM PLUS ET

    • Eco-friendly Cr-free etchant for plastic
      Etching and catalyzing can do at the same time
    • Etchant
    • ABS
  • TOP ZECROM PLUS R

    • Reducing agent for TOP ZECROM PLUS PROCESS
      Reduce manganase from heptavalent to divalent
    • Manganese Reduction
    • ABS
  • TOP ZECROM PLUS NI(X Type)

    • Alkaline-type electroless nickel plating solution for TOP ZECROM PLUS PROCESS
      Excellent in deposition reaction, prevent no-deposition defects
      High bath stability, a long bath life
      Lead-free
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS
  • CRP-LP CONDITIONER F

    • Improve catalyst adsorption ability to plastic surface
      Make palladium catalysts adsorbed uniformly
      Improve the stability of deposition performance
      Tolerant against chromic acid drag-in
    • Surface Conditioner
    • PC/ABS
  • TOP ZECROM PLUS PE

    • Pre-etching and swelling agent for PC/ABS resin
      Can promote etching power and catalyst adsorption
    • Pre-etching Agent
    • PC/ABS
  • CRP CONDITIONER 551M

    • Use for PC/ABS resin
      Improve adsorption condition of catalysts on resin surfaces
      Prevent deposition on and around areas covered by resists
    • Surface Conditioner
    • PC/ABS
  • SURF PC-724

    • Use for PC resin before plating
      Can obtain adhesion performance and apperance like ABS resin
    • For Polycarbonate

      Pre-etching Agent
    • Polycarbonate(PC)
  • SURF PP ACTIVE AGENT N

    • Use for PP resin in pre-etching step
    • Pre-etching Agent

      For Polypropylene
    • Polypropylene(PP)
  • PBT ETCHANT TR-F

    • Roughen surface of PBT resin
      Prevent deterioration of matrix
      Improve adhesion power
      PFOS-, PFOA-free
      Exclusive for Toray PBT resin
    • Etchant

      For PBT
    • Polybutylene terephthalate(PBT)
  • NACION PROCESS

    • Chromium-free plating process on nylon (PA6)
      No depsition on jigs
    • For Nylon
    • Polyamide(PA)
  • TN CATALYST

    • Prevent deterioration of nylon surface
      Auxiliary agent to maintain the stability of catalyzing bathes
    • Catalyzer

      For Nylon
    • Polyamide(PA)
  • TN ETCHANT MK

    • Make etching effect by hydrochloric acid uniform
      Increase adhesion performance
    • Etchant

      For Nylon
    • Polyamide(PA)
  • TN ETCHANT

    • Promote etching effect of hydrochloric acid
      Increase adhesion performance
    • Etchant

      For Nylon
    • Polyamide(PA)
  • TOP TFAC NEUTRALIZER(EDCM)

    • Remove manganese oxide from CFRP surface
      Use after TFAC EPOETCH step
      Have strong permeability into small areas
    • Neutralizer
    • Carbon fiber reinforced plastics(CFRP)
  • TOP TFAC CHEMICAL NICKEL

    • Stably fine, shiny and soft films can be obtained in continuous use
      Excellent in deposition performance
      Lead-free product
    • Alkaline Type Electroless Nickel Plating Solution

      For CFRP
    • Carbon fiber reinforced plastics(CFRP)
  • TOP TFAC PROCESS

    • Plating process for CFRP containing epoxy
      Excellent in deposition performance and adhesion power
    • For CFRP
    • Carbon fiber reinforced plastics(CFRP)
  • TOP TFAC PREDIP

    • Improve the wettability and permeability of substrates
      Stabilize alkaline ionic catalysys absorbing on surfaces
    • Pre-dipping Agent

      For CFRP
    • Carbon fiber reinforced plastics(CFRP)
  • TOP TFAC CONDITIONER

    • Remove dirt from CFRP containing epoxy
      Use after TOP TFAC CATALYST to increase palladium adsorption performance
      PFOS-, PFOA-free product
    • Surface Conditioner

      For CFRP
    • Carbon fiber reinforced plastics(CFRP)
  • TOP TFAC CATALYST

    • Alkaline ionic catalysts solution for CFRP
      Better adhesion performance than acidic catalysts can be obtained
      Excellent in deposition performance of electroless plating
    • Catalyzer

      For CFRP
    • Carbon fiber reinforced plastics(CFRP)
  • TOP TFAC EPOETCH

    • Show micro-etching effect on epoxy surface
      Improve wettability of CFRP
    • Etchant

      For CFRP
    • Carbon fiber reinforced plastics(CFRP)
  • TOP TFAC ACELERATER

    • Activate the catalysts after TOP TFAC CATALYST step
      Economical product (because boric acid can be added separately)
    • Accelerator

      For CFRP
    • Carbon fiber reinforced plastics(CFRP)
  • TOP TFAC SW

    • Show swelling effect for CFRP containing epoxy
      Improve etching effect of TOP TFAC EPOETCH
    • Swelling Agent

      For CFRP
    • Carbon fiber reinforced plastics(CFRP)