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  • MUDEN NOBLE AU

    • For immersion gold plating
      Neutral-type, cyanide-free product
      For flash gold plating
    • Neutral Electroless Ni-P/Au Plating Process

      Electroless Gold Plating Solution
    • Printed Wiring Board, Low temperature co-fired ceramics(LTCC), Molded interconnect device(MID)

  • FLASH GOLD NC

    • Neutral type electroless gold plating solution
      Sulfite based, cyanide free product
      High deposition performance on high P content electroless nickel plating films
      High deposition performance on palladium plating films
    • Electroless Ni-P/Au Plating Process

      Electroless Gold Plating Solution
    • Printed Wiring Board, Copper alloy, Low temperature co-fired ceramics(LTCC)

  • FLASH GOLD 505

    • Immersion gold plating solution
      Use with potassium dicyanoaurate (I)
      Low gold concentration (0.5 g/L)
    • Electroless Ni-P/Au Plating Process

      Electroless Gold Plating Solution
    • Printed Wiring Board, Nickel

  • NNP POSTDIP 401

    • Strongly remove catalyst residue
    • Neutral Electroless Ni-P/Au Plating Process

      Post-dipping Agent
    • Printed Wiring Board, Low temperature co-fired ceramics(LTCC)

  • NNP NICORON LTC

    • For electroless Ni-P plating, neutral type bath
      Lead-free product
      (P content: 5% by weight)
    • Neutral Electroless Ni-P/Au Plating Process

      Electroless Nickel Plating Solution
    • Printed Wiring Board, Low temperature co-fired ceramics(LTCC)

  • NNP CLEANER

    • Weak-alkaline product
      Great permeability power
    • Neutral Electroless Ni-P/Au Plating Process

      Alkaline Cleaner
    • Printed Wiring Board, Low temperature co-fired ceramics(LTCC)

  • NNP ACCERA

    • Activate silver pastes
    • Neutral Electroless Ni-P/Au Plating Process

      Activator
    • Printed Wiring Board, Low temperature co-fired ceramics(LTCC)

  • ICP NICORON FPF-TM

    • High folding endurance
      Deposition rate 12μm/h (P content: 7 to 11% by weight)
      Prevent blackening and corrosion after stripping immersion gold plating
      Excellent in solder wet and solder joint performance
      Fine pattern and semi-bright appearance can be obtained
    • Electroless Ni-P/Au Plating Process

      Electroless Nickel Plating Solution
    • Printed Wiring Board

  • ICP ACCERA COA

    • Reducing type catalyzing solution
      Prevent copper circuit corrosion
      Prevent voids
      Selectively activate copper circuit pattern
      Excellent in fine pattern forming performance
    • Electroless Ni-P/Au Plating Process

      Activator
    • Printed Wiring Board

  • FLASH GOLD 330S

    • High solder wettability, solder joint strength
      Reduce damage to base nickel films
      Fine and uniform deposition
      Deposition rate: 0.085μm/10min (at 84℃)
    • Electroless Ni-P/Au Plating Process

      Electroless Gold Plating Solution
    • Printed Wiring Board

  • ICP CLEAN T-2

    • Low-foaming, foams can be broken easily
      Suitable for spray machine
      Strongly remove dirt and resist residues
      Low surface tension, high permeability
    • Electroless Ni-P/Au Plating Process

      Alkaline Cleaner
    • Printed Wiring Board

  • TOP TNPG NICORON TU

    • High covering performance, uniform deposition by small thickness
      Deposition rate 0.15μm/2min
      Excellent in fine patterning formation performance
      High solder joint, high gold wire bonding performance
    • Electroless Ni-P/Pd/Au Plating Process

      Electroless Nickel Plating Solution
    • Printed Wiring Board

  • ICP ACCERA AP

    • Excellent in fine pattern formation performance
      High selectivity to copper patterns
      Prevent copper dissolution, a long bath life
    • Electroless Ni-P/Au Plating Process

      Activator
    • Printed Wiring Board

  • TOP GILD AU

    • Immersion-reducing type gold plating solution on copper
      Prevent damage on copper
      Uniform films can be obtained
      Great solder jointing performance
    • Electroless Pd/Au Plating Process

      Electroless Gold Plating Solution
    • Printed Wiring Board

  • OPC HOLE PROTECTOR

    • Acidic treatment agent to prevent deposition of electroless nickel plating into non-conductive holes in PWB
      Prevent electroless nickel deposition out of patterns
    • Electroless Ni-P/Au Plating Process

      Catalyst Masking Agent
    • Printed Wiring Board

  • FLASH GOLD 330

    • Reduce damage to nickel films
      Fine and uniform film appearance can be obtained
      High solder wettability and solder joint strength
      Can use at a low temperature (0.06μm/10min at 80℃)
    • Electroless Ni-P/Au Plating Process

      Electroless Gold Plating Solution
    • Printed Wiring Board

  • ICP POSTDIP T-1

    • Use as pretreatment for isolated circuit patterns
      Use after accelerating step
      Prevent electroless nickel deposition out of patterns
      Excellent in fine pattern formation performance
    • Electroless Ni-P/Au Plating Process

      Post-dipping Agent
    • Printed Wiring Board

  • ICP POSTDIP RP

    • For pretreatment to isolated circuit patterns
      Use after Pd acceleration to remove palladium from surfaces
      High selectivity only to copper electrodes
      Excellent in fine pattern formation performance
    • Electroless Ni-P/Au Plating Process

      Post-dipping Agent
    • Printed Wiring Board

  • ICP NICORON SOF(NP)

    • Electroless Ni-P plating solution for isolated circuit patterns
      High-P content
      High corrosion resistance
      High tolerance to sulfurous acid gas
    • Electroless Ni-P/Au Plating Process

      Electroless Nickel Plating Solution
    • Printed Wiring Board

  • ICP NICORON SOF

    • Electroless Ni-P plating solution for isolated circuit patterns
      High-P content, high corrosion resistance
      High tolerance to sulfurous acid gas
    • Electroless Ni-P/Au Plating Process

      Electroless Nickel Plating Solution
    • Printed Wiring Board

  • ICP NICORON HFP

    • Electroless Ni-P plating solution
      Great corrosion resistance
      For fine pattern formation
      (P content: 11% by weight)
    • Electroless Ni-P/Au Plating Process

      Electroless Nickel Plating Solution
    • Printed Wiring Board

  • ICP NICORON GME(NP)

    • Electroless Ni-P plating on ceramic boards
      Lead-free product
      (P content: 7% by weight)
    • Electroless Ni-P/Au Plating Process

      Electroless Nickel Plating Solution
    • Printed Wiring Board

  • ICP NICORON GM-SE

    • Electroless Ni-P plating solution
      High corrosion resistance, high solder wettability
      (P content: 9% by weight)
    • Electroless Ni-P/Au Plating Process

      Electroless Nickel Plating Solution
    • Printed Wiring Board

  • ICP NICORON FPF

    • Electroless Ni-P plating solution
      Have strong folding endurance
      Best for FPC substrates
      (P content: 7% by weight)
    • Electroless Ni-P/Au Plating Process

      Electroless Nickel Plating Solution
    • Printed Wiring Board

  • ICP CLEAN S-135K

    • Acidic type product, have strong cleaning power
      Great peameability
    • Electroless Ni-P/Au Plating Process

      Acidic Cleaner
    • Printed Wiring Board

  • ICP CLEAN 310

    • Acidic cleaner for isolated circuit pattern
      Conduct micro-etching on copper surface
      Strongly clean copper surface for fine pattern forming
    • Electroless Ni-P/Au Plating Process

      Acidic Cleaner
    • Printed Wiring Board

  • ICP ACCERA

    • Show great selectivity
      Work as activator
    • Electroless Ni-P/Au Plating Process

      Activator
    • Printed Wiring Board

  • PALLATOP N

    • Pure-type palladium films can be obtained
      For fine pattern formation
    • Electroless Ni-P/Pd/Au Plating Process

      Electroless Palladium Plating Solution
    • Printed Wiring Board

  • PALLATOP LP

    • Auto-catalytic type electroless palladium plating solution
      Palladium purity over 99％ (P content below 1%) is possible
      Great bath stability, tolerant against dragged-in impurities
      High solder-joint and heat-resistant gold wire bonding performance can be obtained after immersion gold plating on PALLATOP LP film
      Neutral bath, reduce damage to substrates
      Cyanide-free products
    • Electroless Ni-P/Pd/Au Plating Process

      Electroless Palladium Plating Solution
    • Printed Wiring Board

  • SELF GOLD OTK-IT

    • Reducing type electroless gold plating solution
      Neutral-type product
      Cyanide-free product
      Excellent in wire bonding performance
    • Electroless Ni-P/Au Plating Process

      Electroless Gold Plating Solution
    • Printed Wiring Board

  • NPG FLASH GOLD SR

    • High solder wettability, solder joint strength and gold wire bonding performance
      Best product for electroless Ni-P/Pd/Au process
      Stable deposition performance, can obtain uniform deposits on palladium films
      High deposition performance (0.1μm/25min, on 0.1μm of palladium film)
      Prevent base film corrosion
    • Electroless Ni-P/Pd/Au Plating Process

      Electroless Gold Plating Solution
    • Printed Wiring Board

  • NPG NICORON LMP

    • Electroless Ni-P plating solution
      For fine pattern formation
      Show high solder joint performance
      P content: 5% by weight
    • Electroless Ni-P/Pd/Au Plating Process

      Electroless Nickel Plating Solution
    • Printed Wiring Board

  • OPC MUDENGOLD 25

    • Electroless gold plating solution
      Alkaline-, reduction-type
      Deposition rate 5μm/h, excellent in gold-wire bonding performance
    • Electroless Ni-P/Au Plating Process

      Electroless Gold Plating Solution
    • Ceramics

  • NNP ACCERA ACP-1

    • Activating agent for LTCC substrate
      Suitable for the substrates that shows weakness to acids
      Activate copper pastes selectively
    • Neutral Electroless Ni-P/Au Plating Process

      Activator
    • Low temperature co-fired ceramics(LTCC)