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  • TOP FLEAD SC(for hoop)

    • Sn-Cu alloy plating bath, not containing lead
      Can use as lead free solder plating
      Can obtain stable alloy ratio at wide current density areas
      (Cu content:1 to 2% by weight)
    • Various Electroplating Chemical

      Tin-Copper Allloy Plating
    • Non ferrous metal, Printed Wiring Board

  • TOP FLEAD SC(for barrel plating)

    • Tin-copper alloy plating bath, not containing lead
      Can use as lead free solder plating
      Can obtain stable alloy ratio at wide current density areas
      (Cu content:1 to 2% by weight)
    • Various Electroplating Chemical

      Tin-Copper Allloy Plating
    • Non ferrous metal, Printed Wiring Board

  • TOP FLEAD SC

    • Lead-free, tin-copper films can be obtained
      Can use as the replacement of lead-based solder plating
      Can obtain stable alloy ratio (Cu content: 1 to 2 % by weight) at wide current density areas
    • Various Electroplating Chemical

      Tin-Copper Allloy Plating
    • Non ferrous metal, Printed Wiring Board

  • TOP FLEAD FLX

    • For sulfuric acid based, bright tin-copper alloy plating bath
      Cu content: 1 to 2% by weight
      Also can use for plating on PWB
      Use by rack plating
    • Various Electroplating Chemical

      Tin-Copper Allloy Plating
    • Non ferrous metal, Printed Wiring Board