The OPC FLET process is an electroless copper plating process that is compatible with semi-additive methods. It has excellent uniform deposition on the material surface and inside via holes, reduces circuit width narrowing during flash etching, and also suppresses precipitation on copper, achieving crystal continuity between inner layer copper and upper layer plating copper. This process is ideal for forming fine patterns and micro via holes on IC substrates, suppressing the generation of voids.
Stabilize catalyst adsorption in alkaline-ionic catalyzing step Give wettability, improve penetrating performance into small-diameter holes Control the amount of residues on copper High connection reliability with inner foils
High connecting reliability with inner copper foil and plated copper Can obtain copper film with small thickness stably Great deposition performance into via-, through-holes High adhesion power on low Ra materials, prevent blisters High purity copper is available Low sheet resistance is possible even by small thickness
