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  • FPF
  • Electronics
  • Printed Wiring Board
  • Electroless Ni/Au Plating Process
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  • ICP NICORON FPF-TM

    • High folding endurance
      Deposition rate 12μm/h (P content: 7 to 11% by weight)
      Prevent blackening and corrosion after stripping immersion gold plating
      Excellent in solder wet and solder joint performance
      Fine pattern and semi-bright appearance can be obtained
    • Electroless Ni-P/Au Plating Process

      Electroless Nickel Plating Solution
    • Printed Wiring Board

  • ICP NICORON FPF

    • Electroless Ni-P plating solution
      Have strong folding endurance
      Best for FPC substrates
      (P content: 7% by weight)
    • Electroless Ni-P/Au Plating Process

      Electroless Nickel Plating Solution
    • Printed Wiring Board