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  • TORYZA LCN FRV

    • Acid copper additive to make rectangle shape
      Can use for micro-pattern formation
      Decrease thickness variation, realize high thickness uniformity
    • Electroplating

      Additive for Acid Copper Plating
    • Wafer

  • TORYZA LCN SD

    • Acid copper plating additive for semiconductor
      High filling poerformance to blind via hole
      Applicabler to treanch filling
      High filling performance by small thickness
    • Electroplating

      Additive for Acid Copper Plating
    • Wafer

  • TORYZA LCN SP

    • Acid copper plating additive for copper pillar formation
      Can make rectangle pattern, high thickness uniformity
    • Electroplating

      Additive for Acid Copper Plating
    • Wafer

  • TORYZA LCN SV

    • Can use via filling to TSV
      Can use for high aspect ratio via filling by small thickness
    • Electroplating

      Additive for Acid Copper Plating
    • Wafer