Can obtain flexible films at wide current density areas Can obtain uniform appearances, prevent defects about appearances Can use platinum auxiliary anodes Excellent in electric potential stability and corrosion resistance Coumarin-free, formaldehyde-free
Uniform semi-bright plating films with high corrosion resistance come available Reduce the impact on appearances by copper impurity accumulation Not containing coumarin, formalin
Uniform semi-bright tone, high leveling and covering power High-grade films can be obtained Reduce the impacts by additives from acid copper plating bathes Not containing coumarin, formalin
Excellent in covering performance at low currect density areas High brightness and leveling performance can be obtained Excellent in covering performance in chromium plating step
Powders can be co-deposited uniformly in low current density, bottom areas of substrates Can reduce the consumption amount of powders Realize beautiful appearances and high corrosion resistance together
Nickel Plating Additive For Micro-porous Chromium Plating
Can co-deposit insoluble ultra-fine patrticles Can obtain beautiful appearances regardless of co-deposition rate Prevent cloudy appearances, high corrosion resistance Can deposit at low-current density, dent areas uniformly Prevent blushing and burnt deposition in Cr plating steps Not damaging to black-color trivalent Cr plating color tones
Nickel Plating Additive For Micro-porous Chromium Plating
Auxiliary agent for bright nickel plating Strongly promote the effectiveness of a primary brightener Prevent poor brightness at high current density areas Maintain the properties of electrolysis deposits