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  • TOP_LUCINA_HV
  • Electronics
  • Printed Wiring Board
  • Acid Copper Plating Additive
Learn more from substrates

  • TOP LUCINA VT

    • Via-filling additive developed also for through-hole plating
      Same via-filling performance equal to TOP LUCINA HV can be obtained
    • For Via-filling Plating
    • Printed Wiring Board

  • TOP LUCINA HV-G

    • For via-hole filling in wide current density areas
      Also excellent in deposition performance into through-holes
      Only for phosphorus content copper anodes
    • For Via-filling Plating
    • Printed Wiring Board

  • TOP LUCINA HV

    • For via-hole filling in wide current density areas
      Also excellent in deposition performance into through-holes
      For insoluble anodes
    • For Via-filling Plating
    • Printed Wiring Board