Excellent in gold wire bonding performance Bath pH is neutral, can use for the substrates that are weak to acid and alkali Deposition speed is approx. 0.6 to 0.8 μm/h Easy wastewater treatment, not containing cyanide compounds High resistance against nickel impurities
Highly precise zincate film can be obtained Suitable for thin aluminum electrodes as low aluminum dissolution Prevent zincate film unevenness before proceeding a next step
Dense zincate films can be obtained. High coverage of electroless nickel plating and uniform appearance is obtained Excellent in plating adhesion strength Less dissolution of aluminum, best for thin aluminum electrodes
Low erosion, maintain the brightness of aluminum electrodes Excellent degreasing and cleaning power Provide wettability to aluminum surfaces Low foaming, can use air agitation and spray
Good solder wettability and solder joint strength, and excellent gold wire bonding properties A dense, uniform-appearing film can be obtained on nickel and palladium films Almost no corrosion of the underlying nickel
A dense, heat-resistant palladium film can be obtained without affecting the underlying nickel Gold plating on palladium provides excellent solderability and gold wire bonding Can be used continuously for up to 2 MTO Neutral bath, little damage to the base material, cyanide compound free
Acid copper plating additive for semiconductor High filling poerformance to blind via hole Applicabler to treanch filling High filling performance by small thickness
Immersion-reduction type electroless gold plating solution Prevent the corrosion of the underlying nickel plating films For low phosphorus and medium phosphorus type electroless Ni-P plating Dense plating films is obtained over nickel and palladium plating films High solder wettability and solder joint strength, excellent in gold wire bondability
Immersion-type electroless gold plating solution For middle-phosphorus type nickel plating films Reduce the corrosion of base nickel plating films Dense gold plating films can be formed High solder wettability and solder joint strength
Cyanide-free, neutral type electroless palladium plating solution Palladium purity over 99wt% (P content:below 1%) can be obtained Dense palladium plating films can be obtained without damaging underlying nickel plating films Excellent solderability and gold wire bondability by nickel/palladium/gold plating films
Sulfur-free, low phosphorus type (P content: 1.5 to 2.5 % by weight) electroless Ni-P plating solution Suitable for power semiconductors that require high temperature bonding and regular use at high temperatures. Excellent crack resistance and less film embrittlement even after heat treatment over 400°C
Sulfur-free low phosphorus type electroless nickel solution For power semiconductors that require high-temperature bonding For power semiconductors that are used at high temperatures Excellent crack resistance even after heat treatment at 300 to 350°C Minimal degradation of solder wettability over time (P content:2-3wt%)
