Via filling additive that enables high current density plating in fine-pattern PWBs Ideal for large diameter vias of PWBs due to its excellent filling performance
Via filling additive that enables high current density processing for fine pattern PWBs Ideal for pattern plating of build-up layers where uniformity of film thickness is important Plating by vertical conveyor continuous plating system at 2~3 A/dm2 is possible
Use as via-filling, also applicable to through- and pattern-plating Void occurrance can be prevented very strongly Can use for via-holes from 30 to 130μm
Acid copper plating additive for via-filling and through hole plating Can realize high throwing power and great via-filling performance at the same time High ductility, bright appearances, great thermal-shock resistance come available Applicable to subtractive costruction method and M-SAP
For via-hole filling in wide current density areas Also excellent in deposition performance into through-holes Only for phosphorus content copper anodes
