Can obtain flexible films at wide current density areas Can obtain uniform appearances, prevent defects about appearances Can use platinum auxiliary anodes Excellent in electric potential stability and corrosion resistance Coumarin-free, formaldehyde-free
Uniform semi-bright plating films with high corrosion resistance come available Reduce the impact on appearances by copper impurity accumulation Not containing coumarin, formalin
Powders can be co-deposited uniformly in low current density, bottom areas of substrates Can reduce the consumption amount of powders Realize beautiful appearances and high corrosion resistance together
Nickel Plating Additive For Micro-porous Chromium Plating
Can co-deposit insoluble ultra-fine patrticles Can obtain beautiful appearances regardless of co-deposition rate Prevent cloudy appearances, high corrosion resistance Can deposit at low-current density, dent areas uniformly Prevent blushing and burnt deposition in Cr plating steps Not damaging to black-color trivalent Cr plating color tones
Nickel Plating Additive For Micro-porous Chromium Plating
Excellent in corrosion-, chemical-resistance Excellent in anti-discoloration performance Small impact to film stress by bath aging High bendability, lead compound free (P content: high, 11 to 12% by weight)
Higher anti-bacterial, anti-virus than the films from hexavalent chromium plating bath Beautiful blue-black appearances by reducing yellow tones Hexavalent-chromium free bath High corrosion resistance
Realize high corrosion resistance by small thickness High current efficiency, high deposition performance Stable nickel rate under wide current density Excellent in hydrogen permeation Great covering abilty, realize uniform deposition
Beautiful blue-black tone can be obtained Reduce yellow tone Excellent in covering and deposition performance High corrosion resistance, high tolerance to salt damage (L* 58, a* 0.2, b* 1.7)
Can obtain Ni-P alloy plating films Show high corrosion-, chemical-resistance, excellent in wear resistance High bath stability, long bath life P content: 10 to 12mass%
Alkaline-type electroless nickel plating solution Can obtain high P content film (P content: 8 to 10%) High corrosion resistance Prevent nickel film dissolution aroung contact points Excellent in selective deposition performance Prevent the deposition to jigs Can decrease nickel concentration, economical product
Alkaline-type electroless copper plating solution Can obtain high P content film (P content: 8 to 10%) High corrosion resistance Prevent nickel film dissolution aroung contact points Excellent in selective deposition performance Prevent the deposition to jigs Can decrease nickel concentration, economical product
Alkaline-type electroless nickel plating solution Ammonia-free, excellent in corrosion resistance Prevent conductivity failure caused by no deposition on jigs Control electroplating film dissolution No need to increase the thickness of electroless nickel plating films (High P content, P content 8 to 10%)
Improve corrosion- and disciloration resistance of electroless Ni-P plating films Not containing chromium, easy wastewater treatment Improve adhesion toward water-, solvent-based coats No impact on plated appearance Better corrosion resistance than hexavalent chromating (when small thickness)
Can maintain deposition speed in continuous use Excellent in corrosion-resistance and anti-discoloration performance (P content: middle, 8 to 10% by weight)
Excellent in corrosion-, chemical-resistance Excellent in anti-discoloration performance Reduce film stress increase even if MTO proceeds (P content: high, 11 to 12% by weight)
Excellent in corrosion-, chemical-resistance The most suitable for parts requiring non-magnetic property For non-magnetic purposes such as plating on resistors (P content: 12 to 13% by weight)
Middle P content, electroless Ni-P plating solution Can maintain deposition speed in continuous use Excellent in corrosion-resistance and anti-discoloration performance (P content: 6 to 10% by weight)
Lead free electroless nickel plating solution from TOP NICORON SA-98 Excellent in corrosion-, chemical-resistance, bath stability Excellent in anti-discoloration performance (P content: high, 10 to 11% by weight)
High P content, electroless nickel plating solution Excellent in corrosion-, chemical-resistance Excellent in anti-discoloration performance Reduce film stress increase even if MTO proceeds (P content: high, 11 to 12% by weight)
Low nickel concentration, can reduce chemical cost for initial-make-up Excellent in corrosion resistance, chemical resistance, discoloration resistance (P content: 11% by weight)
Excellent in corrosion-, chemical-resistance The most suitable for parts requiring non-magnetic property For non-magnetic purposes such as plating on resistors (P content: high, 12 to 13% by weight)
Can make films having low electrical resistance and high corrosion resistance Film specifications can be selected by treatment temperature and treatment time High adhesion power to coating films Chromic-acid free product
Chemical Conversion Chemical for Magnesium and Its Alloys (TOP MAGSTAR Process)Chemical Conversion Agent
Can make films having low electrical resistance and high corrosion resistance Film specifications can be selected by treatment temperature and treatment time High adhesion power to coating films Chromic-acid free product
Excellent fine patterning performance, selectively activates copper circuits Low palladium concentration, little corrosion to copper, long bath life (Pd 7 mg/L). Little effect on adhesion of liqui-type d solder resists
