Lead-free electroless Ni-Fe alloy plating solution Uniform alloy films (Fe content : 25％ by weight) can be obtained Excellent in shielding effect against low frequency magnetic waves Hardness:Hv700 (as deposited), Hv1050 (after heat treatment)
Lead-free product High deposition performance High film hardness is available without heat treatment The most suitable for electronic components and ceramics Can use continuously by replenishing (B content: 0.2 to 0.6% by weight)
For batch application, lead-free product Excellent in deposition performance High film hardness without heat treatment Best for electronic components and ceramics
Lead-free product High deposition performance High film hardness is available without heat treatment The most suitable for electronic components and ceramics Can use continuously by replenishing (B content: below 0.2 to 0.6% by weight)
Lead compounds are not used High hardness (about Hv700) without heat treatment. P content is 1 to 2 % by weight Good wear resistance Long-term use is possible by replenishment method
Silicon carbide/nickel composite plating solution Low phosphorus type films come available (P content: 1 to 3％ by weight) Excellent in film hardness (Hv700 to 750) Excellent in wear resistance Higher film hardness can be obtained after heat treatment Can be used continuously Maintain almost the same film properties from an initial-make up time to 2, 3 MTO
Electroless Ni-P/PTFE composite plating solution (P content:1 to 3 ％ by weight, PTFE co-deposition content: below 5% by volume) High hardness, Hv650 to 700 Pb compounds, PFOS, PFOA free product Low coefficient of friction, high sliding performance Not adhesive film High mold-releasing, water repellent, oil repellent performance Can use for 3MTO, maintain PTFE content
Can obtain semi-bright bismuth-antimony alloy plating films (Sb content: 5 to 10 mass%) Higher film hardness and sliding performance than bismuth plating films
Lead-free version from TOP NICORON LPH Low P content High film hardness without heat treatment High wear resistance (P content: low, 1 to 2% by weight)
Containing aluminum oxide and fat, LIME type product Can adjust hardness if mixed with kerosene or machine oil Can apply buffing compounds directly on metals Buffing compounds will not be scattered easily and can be removed easily
