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  • pattern uniform
  • Electronics
  • Printed Wiring Board
  • Acid Copper Plating Additive
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  • TOP LUCINA NSV ADV

    • Via filling additive that enables high current density processing for fine pattern PWBs
      Ideal for pattern plating of build-up layers where uniformity of film thickness is important
      Plating by vertical conveyor continuous plating system at 2~3 A/dm2 is possible
    • For Via-filling Plating
    • Printed Wiring Board
  • TOP LUCINA NSV

    • For via-filling, applicable to high-throwing bath
      Excellent in uniform deposition performance
      Best for IC substrates with fine patterns
    • For Via-filling Plating
    • Printed Wiring Board