2023.11.02표면처리무기재료전시회정보

"TPCA Show 2023" 에 출전했습니다.

2023년10월25일(수) 부터27일(금)까지 개최된 "TPCA Show 2023" 에서당사부스를 방문해주셔서 대단히 감사합니다.
자세한 사항은 홈페이지를 통해서문의 부탁드립니다.

일시

2023년10월25일(수) 부터27일(금)

개최 장소

Nangang Exhibition Center Hall (TaiNEX 1)

내용

Plating technology for wafer

• Acid copper plating additives
  Additive for acid copper plating for TSV filling
  Additive for acid copper plating for Cu pillar formation
  Additive for acid copper plating for low aspect ratio via and trench filling
• Electroless copper plating process ensuring high adhesion for glass substrates
• UBM (Under Barrier Metallization) process for Al electrode on wafer

The latest surface finish for IC substrates

• Electroless Cu plating process for high connection reliability
• Additive for acid copper plating for high thickness uniformity and via filling
• Palladium residue remover applicable to fine patterns
• Electroless Ni/Au process using reduced cobalt catalyzing solution

The latest surface finish for PWB

• Additive for acid copper plating with high via-filling performance to large diameter holes

The latest surface finish for FPC

• Electroless Cu plating process to LCP films for high-frequency and high-speed transmission
• Additive for acid copper plating applicable to horizontal Roll to Roll plating equipment
• Electroless Ni/Au process for ultra-fine pattern formation

The latest surface finish for power modules

• Electroless plating process to dielectronic substrates for power modules

Glass materials for electronic components