2025.05.08표면처리무기재료전시회정보

JPCA Show 2025 출전 안내

당사는 2025년 6월 4일(수) ~ 6월6일(금)에 도쿄 빅사이트에서 개최되는 제「JPCA Show 2025」에 출전합니다.
당사의 부스 위치는 동7홀의 【7D-01】입니다.
사원 일동 모두 여러분의 방문을 진심으로 기다리고 있겠습니다.

일시

2025년 6월 4일(수) ～ 6일(금) 10:00 to 17:00

개최 장소

도쿄 빅사이트, 동7홀, 【7D-01】

내용

Surface finishing technology to glass core substrares

• Highly adhesive plating process on glass
• Acid copper plating additive for through-hole filling to glass core substrates

Plating technology for wafer and power modules

• UBM formation on aluminum electrode on wafer
• Electroless plating equipment for wafer to make UBM
• Acid copper plating additive to silicon interposer for high aspect ratio filling
• Acid copper plating additive to micro bump and trench filling
• Acid copper plating additive to FO-PLP/WLP, high current density for copper pillar formation
• Acid copper plating additive for ultra-fine pattern formation
• Acid copper plating additive for Cu-Cu hybrid bonding
• Electroless plating process to dielectric substrate for power modules

The latest surface finish for IC substrates

• Electroless copper plating process to solve Weak-Micro Via for high connection reliability
• Acid copper plating additive for high-current density, fine pattern via filling
• Acid copper plating additive for large diameter vias

The latest surface finishing for FPCs

• For fine pattern formation, high joint reliability electroless nickel/gold plating process
• Highly-reliable granular copper plating technology with high adhesion to molding materials
• Acid copper plating additive for high aspect ratio
• Lead-free glass flit for electronic components

URL

https://www.jpcashow.com/show2025/en/