2025.12.23표면처리전시회정보

제27회 반도체･센서 패키징전 반도체 후공정 전문전 (ISP) 출전 안내

2026년 1월 21일(수)~23일(금)에 TOKYO BIG SIGHT서 개최되는 "제27회 반도체・센서 패키징전 반도체 후공정 전문전(ISP) "에 출전합니다. 사원 일동 모두 여러분의 방문을 진심으로 기다리고 있겠습니다.

일시

2026년 1월 21일(수)~23일(금)

개최 장소

도쿄 빅사이트, 동7홀, 【E30-18】

내용

Surface finishing technology to glass substrates

• Highly adhesive plating process on glass
• Acid copper plating additive for through-hole filling to glass core substrates

Plating technology for semiconductor wafer

• UBM formation for Al electrode on wafer
• Electroless plating equipment for wafer to make UBM
• Acid copper plating additives to semiconductor wafer
• Acid copper plating additive for Cu-Cu hybrid bonding
• Electroless plating process for insulated heat dissipation substrate (for power modules)

Plating technology for IC substrates

• Electroless copper plating process to solve Weak-Micro Via for high connection reliability
• Acid copper plating additive for high-current density, fine pattern via filling
• Acid copper plating additive for large diameter via filling
• Highly-reliable granular copper plating technology with high adhesion to molding materials

The latest surface finishing process

• New mist CVD equipment for next-generation power semiconductor : r-GeO₂(under development)

URL

https://blog.naver.com/reed_japan/223336855920