2025.12.24표면처리무기재료전시회정보
"SURTECH2026" 출전 안내
2026년 1월 28일(수)~ 30일(금)에 TOKYO BIG SITE서 개최되는 SURTECH2026에 출전합니다. 사원 일동 모두 여러분의 방문을 진심으로 기다리고 있겠습니다.

- 일시
-
2026년 1월 28일(수)~30일(금)
- 개최 장소
-
도쿄 빅사이트, South 3・4 Hall, 4S-R07
- 내용
-
Surface finishing technology to glass core substrates
- Highly adhesive plating process on glass
- Acid copper plating additive for though-hole filling to glass core substrates
New surface finishing technology
- UBM formation on aluminum electrode on wafer
- Electroless plating equipment for wafer to make UBM
- Plating process on PPS especially for EMI shielding application
- Crack inhibitor for aluminum hard anodizing
Surface finishing for environmentally friendly
- Eco-friendly aluminum anodizing process
- Long bath life, high speed type electroless nickel plating solution
- Hexavalent chromium free plating process for plastic
- White color decorative trivalent chromium plating solution
- Fluoropolymer free coating solution (Non-adhesive, anti-dirt)
- Fluoropolymer free coating for food utensils
- URL
- https://www.surtech.jp/en/